Ming-Chao Tsai

Recent Research and Emerging Challenges in Physical Design for Manufacturability/Reliability

Yao-Wen Chang, Kuang-Yao Lee, Ting-Chi Wang, 2007, 2007 Asia and South Pacific Design Automation Conference.

A study on the trade-off among wirelength, number of TSV and placement with different size of TSV

TingTing Hwang, Ming-Chao Tsai, 2011, Proceedings of 2011 International Symposium on VLSI Design, Automation and Test.

An MILP-based wire spreading algorithm for PSM-aware layout modification

Ting-Chi Wang, Yung-Chia Lin, Ming-Chao Tsai, 2008, 2008 Asia and South Pacific Design Automation Conference.

Through-Silicon Via Planning in 3-D Floorplanning

Ting-Chi Wang, Ming-Chao Tsai, Ting Ting Hwang, 2011, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Maze routing with OPC consideration

Ting-Chi Wang, Ming-Chao Tsai, Yun-Ru Wu, 2005, ASP-DAC.

Signal through-silicon via planning in 3D fixed-outline floorplanning

Ting-Chi Wang, TingTing Hwang, Ming-Chao Tsai, 2010, The 2010 International Conference on Green Circuits and Systems.

Maze routing with OPC consideration

Ting-Chi Wang, Ming-Chao Tsai, Yun-Ru Wu, 2005, Proceedings of the ASP-DAC 2005. Asia and South Pacific Design Automation Conference, 2005..