B. C. Kim

A novel MCM interconnect test technique based on resonator principles and transmission line theory

Madhavan Swaminathan, B. C. Kim, A. Chatterjee, 1995, Proceedings of Electrical Performance of Electronic Packaging.

A new test method for embedded passives in high density package substrates

B. C. Kim, Hyek-Hwan Choi, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

A Study of Equipment, Processes, and Systems for a Demilitarization Facility at Naval Ammunition Depot, Hawthorne, Nevada. Phase I. Information Gathering and Plan Generation.

B. C. Kim, R. W. Bennett, G. G. Zeidman, 1975 .

Effects of floating heat spreader in high density BGA packages

B. C. Kim, Dae-Hyun Han, V. Varadarajan, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Recent experiences on developing multimedia educational modules

B. C. Kim, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Progress on developing electronic packaging educational modules

B. C. Kim, C. Severance, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

International web course on mixed signal IC test

Se-Hyun Park, B. C. Kim, V. Varadarajan, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

A probe routing algorithm for MCM substrate test

B. C. Kim, R. Yan, Rongchang Yan, 1998, Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).

Proposed strategies for microelectronic packaging education for next generation engineers

B. C. Kim, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).