Wan Lixi

System-on-Package and its Research Areas

Wan Lixi, 2007 .

Design of HDMI Fiber and Automated Testing

Wan Lixi, 2011 .

リジッド‐フレックス基板に基づくRFフロントエンドSiPのための熱管理の最適化と検証【Powered by NICT】

Li Jun, Zhang Jing, Wu Peng, 2016 .

Analysis and Optimization of Wire-bonding Interconnect Characteristics in Millimeter-wave Band

Wan Lixi, 2013 .

New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair

Li Jun, Zhou Jing, Wan Lixi, 2013 .

Non-self-intersection graphics combination algorithm based on vector wander method

Wan Lixi, 2012 .

Enclosed areas in 2D graphics automatic identification algorithm

Wan Lixi, 2012 .

The impact of wire bonding on the transmission performance of high-speed links in SiP

Yang Kun, Wan Lixi, Gao Wei, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

A novel wirebond-BGA CPU package

Li Jun, Wang Qidong, Zhang Jin, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Effects of via pitch on silicon stress in TSV interposer

Qin Fei, Wan Lixi, Wu Wei, 2012 .

Interfacial stress in Through Silicon Vias

Qin Fei, Wan Lixi, Wu Wei, 2012 .