Yoshihiko Kanda

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Yoshiharu Kariya, Yoshihiko Kanda, Y. Kariya, 2012, Microelectron. Reliab..

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Shunichi Kikuchi, Yoshiharu Kariya, Yoshihiko Kanda, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint

Yoshiharu Kariya, Yoshihiko Kanda, Y. Kariya, 2010 .

Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint

Yoshiharu Kariya, Yoshihiko Kanda, Y. Kariya, 2008 .

Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint

Yoshiharu Kariya, Yoshihiko Kanda, Y. Kariya, 2012, Journal of Electronic Materials.