Shiang-Yu Teng

Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method

Sheng-Jye Hwang, Shiang-Yu Teng, Sheng-Jye Hwang, 2007, Microelectron. Reliab..

Prediction of Process Induced Warpage of Electronic Package by P-V-T-C Equation and Taguchi Method

Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, 2006, 2006 International Conference on Electronic Materials and Packaging.

Simulations and experiments of three-dimensional paddle shift for IC packaging

Sheng-Jye Hwang, Shiang-Yu Teng, Sheng-Jye Hwang, 2008 .