文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
Thomas F. Hayes
发表
Modeling of multiconductor systems for packaging and interconnecting high-speed digital IC's
Thomas F. Hayes, John J. Barrett, 1992, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..