Xin Zhao

发表

Robust Clock Tree Synthesis with timing yield optimization for 3D-ICs

Jae-Seok Yang, Jiwoo Pak, Xin Zhao, 2011, 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011).

Analysis and Design of Energy and Slew Aware Subthreshold Clock Systems

Xin Zhao, Sung Kyu Lim, Saibal Mukhopadhyay, 2011, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Low-Power and Reliable Clock Network Design for Through-Silicon Via (TSV) Based 3D ICs

Xin Zhao, Sung Kyu Lim, J Minz, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs

Xin Zhao, Sung Kyu Lim, Michael Scheuermann, 2012, DAC Design Automation Conference 2012.

Buffered clock tree sizing for skew minimization under power and thermal budgets

Xin Zhao, Sung Kyu Lim, Krit Athikulwongse, 2010, 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC).

Buffered clock tree synthesis for 3D ICs under thermal variations

Xin Zhao, Sung Kyu Lim, Jacob R. Minz, 2008, 2008 Asia and South Pacific Design Automation Conference.

Effect of Amphiphilic Polymer/Nano-Silica Composite on Shale Stability for Water-Based Muds

Xin Zhao, Peng Yang, Zhengsong Qiu, 2018, Applied Sciences.

Slew-aware clock tree design for reliable subthreshold circuits

Xin Zhao, Sung Kyu Lim, Saibal Mukhopadhyay, 2009, ISLPED.

Power and slew-aware clock network design for through-silicon-via (TSV) based 3D ICs

Xin Zhao, Sung Kyu Lim, 2010, 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC).

Through-silicon-via-induced obstacle-aware clock tree synthesis for 3D ICs

Xin Zhao, Sung Kyu Lim, 2012, 17th Asia and South Pacific Design Automation Conference.

Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores

Hsien-Hsin S. Lee, Xin Zhao, Sung Kyu Lim, 2011, 2011 IEEE 29th International Conference on Computer Design (ICCD).

An Efficient Computation of Statistically Critical Sequential Paths Under Retiming

Xin Zhao, Sung Kyu Lim, Mongkol Ekpanyapong, 2007, 2007 Asia and South Pacific Design Automation Conference.

Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model

Chun Zhang, Hao Yu, Yang Shang, 2013, 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC).

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)

Hsien-Hsin S. Lee, Xin Zhao, Sung Kyu Lim, 2015, IEEE Transactions on Computers.

Variation-aware clock network design methodology for ultra-low voltage (ULV) circuits

Xin Zhao, Sung Kyu Lim, Chang Liu, 2011, ISLPED.

Low-Power Clock Tree Design for Pre-Bond Testing of 3-D Stacked ICs

Hsien-Hsin S. Lee, Xin Zhao, Sung Kyu Lim, 2011, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory

Hsien-Hsin S. Lee, Xin Zhao, Sung Kyu Lim, 2010, IEEE Custom Integrated Circuits Conference 2010.

3D-MAPS: 3D Massively parallel processor with stacked memory

Hsien-Hsin S. Lee, Xin Zhao, Sung Kyu Lim, 2012, 2012 IEEE International Solid-State Circuits Conference.

Variation-tolerant and low-power clock network design for 3D ICs

Xin Zhao, Sung Kyu Lim, Saibal Mukhopadhyay, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Reliable clock and power delivery network design for three-dimensional integrated circuits

Xin Zhao, 2012 .

Advanced Material Strategies for Next-Generation Additive Manufacturing

Xin Zhao, Jiankang He, Dichen Li, 2018, Materials.

Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs

Xin Zhao, Sung Kyu Lim, Yang Wan, 2013, 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).

Pre-bond testable low-power clock tree design for 3D stacked ICs

Hsien-Hsin S. Lee, Xin Zhao, Sung Kyu Lim, 2009, 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers.

Transient Modeling of Electromigration and Lifetime Analysis of Power Distribution Network for 3 D ICs

Xin Zhao, Sung Kyu Lim, Michael Scheuermann, 2013 .