F. X. Che
发表
Comprehensive study on reliability of chip-package interaction using Cu pillar joint onto low k chip
Xiaowu Zhang,
F. X. Che,
Jong-Kai Lin,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
John H. L. Pang,
F. X. Che,
Desmond Y. R. Chong,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
F. X. Che,
M. Kawano,
M. Z. Ding,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
F. X. Che,
Jong-Kai Lin,
K. Y. Au,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Rui Zhang,
Toshitsugu Ueda,
F. X. Che,
2012,
Microelectron. Reliab..
Xiaowu Zhang,
T. C. Chai,
F. X. Che,
2012,
IEEE Transactions on Device and Materials Reliability.
John H. L. Pang,
F. X. Che,
2009,
Microelectron. Reliab..
John H. L. Pang,
F. X. Che,
F. Che,
2015,
Microelectron. Reliab..
Chee Lip Gan,
F. X. Che,
W. N. Putra,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
K. H. Low,
Yuqi Wang,
Kay Hiang Hoon,
2006,
Microelectron. Reliab..
F. X. Che,
M. Z. Ding,
L. Bu,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Shan Gao,
Xiaowu Zhang,
Dim-Lee Kwong,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
F. X. Che,
K. Y. Au,
Eva Wai Leong Ching,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).