K. Y. Au
发表
Comprehensive study on reliability of chip-package interaction using Cu pillar joint onto low k chip
Xiaowu Zhang,
F. X. Che,
Jong-Kai Lin,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
F. X. Che,
Jong-Kai Lin,
K. Y. Au,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
F. X. Che,
K. Y. Au,
Eva Wai Leong Ching,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
John H. Lau,
Ying Ying Lim,
K. Y. Au,
2009,
2009 59th Electronic Components and Technology Conference.
K. Y. Au,
X. R. Zhang,
W. H. Zhu,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
K. Y. Au,
Jong-Kai Lin,
J. Aw,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Xiaowu Zhang,
Jong-Kai Lin,
K. Y. Au,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
K. Y. Au,
S. Kriangsak,
S. Nathapong,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
K. Y. Au,
Xiaowu Zhang,
K. Chui,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
K. Y. Au,
Xiaowu Zhang,
F. Che,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).