T. Kurosawa

Novel DAF (Die Attach Film) separation technologies for ultra-thin chip

S. Takyu, T. Kurosawa, A. Tomono, 2012, 2012 2nd IEEE CPMT Symposium Japan.

A study on chip thinning process for ultra thin memory devices

S. Takyu, T. Kurosawa, J. Sagara, 2008, 2008 58th Electronic Components and Technology Conference.

Novel wafer dicing and chip thinning technologies realizing high chip strength

N. Shimizu, S. Takyu, T. Kurosawa, 2006, 56th Electronic Components and Technology Conference 2006.