Jae-Chul Jin

Hinge device for a portable communication device

Jae-Chul Jin, Se-Bum Choi, 2009 .

Assessment of Influence and Analysis of Mechanism on the Reliability for Solder Joints of Electronic Device

Qiang Yu, Masaki Shiratori, Jae-Chul Jin, 2005 .

Slide / swivel module and portable terminal so

Young-Ki Kim, Jae-Chul Jin, Jin-Soo Kim, 2007 .

Assessment of influence on the reliability for solder joints of electronic device and elucidation of mechanism

Qiang Yu, Masaki Shiratori, Jae-Chul Jin, 2004 .

Easy reliability design approach for solder joint BGA package considering correlation of each design factor

Jae-Chul Jin, T. Shibutani, M. Shiratori, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

The assessment of influence and mechanism of the design factors on the reliability of EGA solder joints

Qiang Yu, Masaki Shiratori, Jae-Chul Jin, 2004 .

Study on influence of the design factors on the reliability of BGA solder joints

Qiang Yu, Jae-Chul Jin, H. Abe, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

P27 Thermal fatigue reliability design of BGA package in electronic devices using CAE

Satoshi Kondo, Qiang Yu, Masaki Shiratori, 2005 .

Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints

Qiang Yu, Masaki Shiratori, Jae-Chul Jin, 2005 .