Horst Rempp

Ultra-Thin Chips on Foil for Flexible Electronics

Martin Zimmermann, Joachim N. Burghartz, Christine Harendt, 2008, 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers.

Thermal characterization and modeling of ultra-thin silicon chips

Joachim N. Burghartz, Zili Yu, Christine Harendt, 2014, 2014 44th European Solid State Device Research Conference (ESSDERC).

Ultra-thin chip technology and applications, a new paradigm in silicon technology

Martin Zimmermann, Joachim N. Burghartz, Christine Harendt, 2010 .

Experiences on reliability simulation in the framework of the PROPHECY project

Andrea Scorzoni, Horst Rempp, S. Minehane, 1999 .

Manufacturing aspects of an ultra-thin chip technology

Joachim N. Burghartz, Christine Harendt, Martin Zimmermann, 2012, 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC).

Ultra-thin chips and related applications, a new paradigm in silicon technology

Joachim N. Burghartz, Christine Harendt, Horst Rempp, 2009, 2009 Proceedings of the European Solid State Device Research Conference.

Electrical Device Characterisation on Ultra-thin Chips

Horst Rempp, Harald Richter, Nicoleta Wacker, 2011 .

Compact modeling of CMOS transistors under variable uniaxial stress

Joachim N. Burghartz, Horst Rempp, Harald Richter, 2011 .

Compensation of externally applied mechanical stress by stacking of ultra-thin chips

Joachim N. Burghartz, Christine Harendt, Horst Rempp, 2011 .

Anomalous stress effects in ultra-thin silicon chips on foil

Joachim N. Burghartz, Horst Rempp, Harald Richter, 2009, 2009 IEEE International Electron Devices Meeting (IEDM).

Packaging challenges associated with warpage of ultra-thin chips

Joachim N. Burghartz, Horst Rempp, Evangelos A. Angelopoulos, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Compensation of externally applied mechanical stress by stacking of ultra-thin chips

Joachim N. Burghartz, Christine Harendt, Horst Rempp, 2011, 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC).