Kang Chen

Study of Board Level Reliability of eWLB (embedded Wafer Level BGA) for 0.35mm Ball Pitch

Seung Wook Yoon, Kang Hai Lee, Yeow Kheng Lim, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Advanced 3D eWLB-PoP (embedded Wafer Level Ball Grid Array - package on package) technology

Seung Wook Yoon, Kang Chen, Yaojian Lin, 2015, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

28nm CPI (Chip/Package Interactions) in Large Size eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages

Seung Wook Yoon, Seng Guan Chow, Kang Chen, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Circuit network analysis method applied to surface acoustic wave impedance system in liquids

Kang Chen, Shouzhuo Yao, L. Nie, 1994 .

Novel surface acoustic wave-interdigitated array electrode gas sensor for dissolved ammonia

Kang Chen, Shouzhuo Yao, L. Nie, 1997 .

Principal component analysis applied to admittance spectra of a quartz-crystal microbalance in contact with a liquid phase

Kang Chen, Shouzhuo Yao, Lihua Nie, 1995 .

Clinical analysis of urea in human blood by coupling a surface acoustic wave sensor with urease extracted from pumpkin seeds

Kang Chen, Shouzhuo Yao, L. Nie, 1995 .