Benson Lin
发表
Seung Wook Yoon,
Kang Hai Lee,
Yeow Kheng Lim,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Ruey-Beei Wu,
I-Hsuan Peng,
Benson Lin,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Z. Lin,
Y. H. Fang,
M. J. Lin,
2017,
2017 IEEE International Reliability Physics Symposium (IRPS).
Benson Lin,
Tom Gregorich,
2011,
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Benson Lin,
Tung-Hsien Hsieh,
Nan-Cheng Chen,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).