P.A. Kohl
发表
J.A. Davis,
R. Venkatesan,
J.D. Meindl,
2001,
International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).
R.R. Tummala,
V. Sundaram,
Y. Fukuoka,
2004,
IEEE Transactions on Advanced Packaging.