Ravi Mahajan

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3D Packaging Architectures and Assembly Process Design

Ravi Mahajan, Bob Sankman, R. Mahajan, 2020, 3D Microelectronic Packaging.

Chapter 5 Ten Commandments of Foot and Ankle Trauma Management

Ravi Mahajan, Arun Bal, Milind Chaudhary, 2016 .

Experimental Study of Two-Phase Cooling to Enable Large-Scale System Computing Performance

Ravi Mahajan, Devdatta Kulkarni, Xudong Tang, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die

Ravi Mahajan, Dereje Agonafer, Abhijit Kaisare, 2007 .

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Mahajan, Hakan Erturk, 2005 .

Chapter 15 Dealing with Tendo Achilles Problems

Ravi Mahajan, Arun Bal, Milind Chaudhary, 2016 .

An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems

Ravi Mahajan, Lesley Polka, M SwanJohanna, 2005 .

Foreword: Special Section on Soft Electronics

Ravi Mahajan, Hanqing Jiang, 2015 .

Mechanical Testing for Stretchable Electronics

Vijay Subramanian, Ravi Mahajan, Pramod Malatkar, 2016 .

Foreword Special Section on Nanopackaging

Ravi Mahajan, P. Markondeya Raj, 2016 .

Cooling a Microprocessor Chip Heat spreading, choice of thermal interface materials, and proper heat-sink design can enhance cooling of microprocessor packages and systems.

Chia-Pin Chiu, Ravi Mahajan, Greg Chrysler, 2006 .

Development of analytical model to a temperature distribution of a first level package With a nonuniformly powered die

Ravi Mahajan, Dereje Agonafer, Abhijit Kaisare, 2009 .

Heterogeneous SoC Integration with EMIB

Sriram Srinivasan, Zhiguo Qian, Ravi Mahajan, 2018, 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities

Ravi Mahajan, Debendra Mallik, Vijay S. Wakharkar, 2008 .

Chapter 12 Lucid Approach and Simplistic Management of Diabetic Foot

Ravi Mahajan, Arun Bal, Milind Chaudhary, 2016 .

Electrical Performance Limits of Fine Pitch Interconnects for Heterogeneous Integration

Zhiguo Qian, Ravi Mahajan, Ahmet C. Durgun, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Towards a Thermal Moore's Law

Suresh V. Garimella, Ravi Mahajan, Shankar Krishnan, 2007 .

Thermal Challenges in Next-Generation Electronic Systems

Sushil H. Bhavnani, Suresh V. Garimella, Chandrakant D. Patel, 2008 .

Applicability of Existing Reliability Models: Focus on Finite Element Modeling of Various BGA Package Designs and Materials

Ravi Mahajan, Amaneh Tasooji, Ali Fallah-Adl, 2011 .

Foreword: Special Section on 3-D Integration

Muhannad S. Bakir, Ravi Mahajan, 2016 .

Chapter 6 Tips, Tricks, and Management Algorithm for Foot and Ankle Injuries

Ravi Mahajan, Arun Bal, Milind Chaudhary, 2016 .

Energy release rate and contact zone in a cohesive and an interface crack by hypersingular integral equations

Erdogan Madenci, Ravi Mahajan, Bahattin Kilic, 2006 .

Special Section on Electrical Contacts

Ronald A. Coutu, Ravi Mahajan, 2017 .

Analysis and implications of ic cooling for deep nanometer scale cmos technologies

Kaustav Banerjee, Vivek De, Sheng-Chih Lin, 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..

Approximate analytical model for a first level package with non-uniformly powered die

Ravi Mahajan, Dereje Agonafer, A. Haji-Sheikh, 2006 .

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Ioan Sauciuc, Ravi Mahajan, Hakan Erturk, 2005 .

Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Ravi Mahajan, Joshua Fryman, Sandeep Sane, 2021, Journal of Lightwave Technology.

8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO

Vladimir Stojanovic, Ravi Mahajan, Mark Wade, 2021, 2021 Optical Fiber Communications Conference and Exhibition (OFC).

The Evolution of Microprocessor Packaging

Ravi Mahajan, R. Mahajan, Ken Brown, 2000 .

Mechanical Testing for Stretchable Electronics

Vijay Subramanian, Ravi Mahajan, Pramod Malatkar, 2017 .

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Sergey V Shkarayev, Erdogan Madenci, Ravi Mahajan, 1997, Application of Fracture Mechanics in Electronic Packaging.

Spreading in the heat sink base: phase change systems or solid metals??

Ioan Sauciuc, Ravi Mahajan, Gregory M. Chrysler, 2002 .

Critical Aspects of High-Performance Microprocessor Packaging

Ravi Mahajan, Ram S. Viswanath, Debendra Mallik, 2003 .

Emerging Directions For Packaging Technologies 62 Emerging Directions For Packaging Technologies

Ravi Mahajan, 2002 .

On-chip cooling by superlattice-based thin-film thermoelectrics.

Ravi Mahajan, Rama Venkatasubramanian, Randall Alley, 2009, Nature nanotechnology.