H. Ben Jamaa

Advances, challenges and opportunities in 3D CMOS sequential integration

J. Mazurier, O. Faynot, P. Batude, 2011, 2011 International Electron Devices Meeting.

Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack

R. Anciant, A. Farcy, T. Lacrevaz, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.