A. Glezer

A Modular Stackable Concept for Heat Removal From 3-D Stacked Chip Electronics by Interleaved Solid Spreaders and Synthetic Jets

Y.K. Joshi, D.W. Gerlach, D. Gerty, 2009, IEEE Transactions on Advanced Packaging.

Acoustically enhanced boiling heat transfer

A. Glezer, Z.W. Douglas, M.K. Smith, 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

Two-phase thermal management using a small-scale, heat transfer cell based on vibration-induced droplet atomization

A. Glezer, S.N. Heffington, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Cooling performance of micromachined self-oscillating reed actuators in heat transfer channels with integrated diagnostics

F. Herrault, M. G. Allen, A. Glezer, 2012, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).

Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets

D. Gerty, A. Glezer, Y.K. Joshi, 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

Control of plane mixing layer - Some novel experiments

H. E. Fiedler, Israel J Wygnanski, A. Glezer, 1988 .

Enhanced mixing in a simulated combustor using synthetic jet actuators

A. Glezer, A. Glezer, Y. Chen, 1999 .

Design and Characterization of a Heat Sink Cooled by an Integrated Synthetic Jet Matrix

D. Gerty, R. Mahalingam, A. Glezer, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..