S.Y. Oh

3D Global Interconnect Parameter ExtractoR for full-chip global critical path analysis

S.Y. Oh, K. Okasaki, J. Moll, 1997, Electrical Performance of Electronic Packaging.

3D GIPER: global interconnect parameter extractor for full-chip global critical path analysis

S.Y. Oh, J. Moll, O.S. Nakagawa, 1996, International Electron Devices Meeting. Technical Digest.