Pengfei Guo

A novel silicon interposer based high security integration approach for microsystem

Chunsheng Zhu, Yingjian Yan, Pengfei Guo, 2021, Microelectron. J..

Leveraging 3D Packaging Technology to Enhance Integrated Circuits Security and Reliability

Chunsheng Zhu, Yingjian Yan, Pengfei Guo, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).