C. F. Murphy

Known Good Die Selection Tradeoffs: A Cost Model

C. F. Murphy, 1994, Proceedings of the International Conference on Multichip Modules.

High-density laminate substrates using a non-subtractive manufacturing process

C. F. Murphy, J. W. Lott, R. K. Kraus, 1997, Proceedings 1997 International Conference on Multichip Modules.

Designing crops for added value: a vision, a mission.

C. F. Murphy, R. A. Kleese, D. M. Peterson, 2000 .

Survey of alternatives to tin-lead solder and brominated flame retardants

C. F. Murphy, G. E. Pitts, C. Murphy, 2001, Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).