Florent Lallemand

TSV technology embedding high density capacitors for Advanced 3D packaging solutions

Catherine Bunel, Florent Lallemand, 2014 .

Integrated 3D-Capacitors for Implantable Bradycardia Pacemakers: Dielectric Integrity and Local Electrical Characterizations using AFM

Florent Lallemand, Catherine Bunel, Nicolas Normand, 2021, BIODEVICES.

Silicon interposers with integrated passive devices, an excellent alternativ to discrete components

Florent Lallemand, Frederic Voiron, F. Lallemand, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).