A. Ukita

Development of optical coupling technologies for Si-photonics-die embedded package substrate

D. Shimura, A. Noriki, I. Tamai, 2021, OPTO.

Advanced devices and packaging of Si-photonics-based optical transceiver for optical interconnection

K. Kurata, Y. Hagihara, J. Fujikata, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).