Yanpeng Gong

Three-dimensional transient heat conduction problems in FGMs via IG-DRBEM

Geyong Cao, Zeng Meng, Bo Yu, 2021 .

IG-DRBEM of three-dimensional transient heat conduction problems

Geyong Cao, Shanhong Ren, Chunying Dong, 2021, Engineering Analysis with Boundary Elements.

Thermal analysis of electronic packaging structure using isogeometric boundary element method

Fei Qin, Huiping Yu, Yanpeng Gong, 2021, Engineering Analysis with Boundary Elements.