Cadmus A. Yuan

Mechanical reliability challenges for MEMS packages: Capping

Willem D. van Driel, G. Q. Zhang, Dao-Guo Yang, 2007, Microelectron. Reliab..

Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes

Bo Li, Jia Zhao, G. Q. Zhang, 2014, Microelectron. Reliab..

The need for multi-scale approaches in Cu/low-k reliability issues

Willem D. van Driel, G. Q. Zhang, Cadmus A. Yuan, 2008, Microelectron. Reliab..

Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

Yang Liu, G. Q. Zhang, Cadmus A. Yuan, 2015, Microelectron. Reliab..

Thermal and mechanical effects of voids within flip chip soldering in LED packages

Yang Liu, Jia Zhao, G. Q. Zhang, 2014, Microelectron. Reliab..

Molecular simulation on the material/interfacial strength of the low-dielectric materials

Willem D. van Driel, G. Q. Zhang, Cadmus A. Yuan, 2007, Microelectron. Reliab..

An accelerated test method of luminous flux depreciation for LED luminaires and lamps

Cadmus A. Yuan, Guo Qi Zhang, C. Qian, 2016, Reliab. Eng. Syst. Saf..