E. Deloffre
发表
E. Deloffre,
C. Euvrard,
D. Le Cunff,
2010,
2010 IEEE International 3D Systems Integration Conference (3DIC).
E. Deloffre,
O. Faynot,
T. Skotnicki,
2008
.
E. Deloffre,
A. Farcy,
P. Vivet,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
S. Jeannot,
E. Deloffre,
S. Cremer,
2007,
2007 IEEE International Electron Devices Meeting.
F. Fournel,
F. Gigon,
E. Deloffre,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
E. Deloffre,
V. Balan,
S. Moreau,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
E. Deloffre,
E. Souchier,
S. Moreau,
2022,
Microelectronic Engineering.
X. Garros,
O. Faynot,
C. Laviron,
2008,
ESSDERC 2008 - 38th European Solid-State Device Research Conference.
T. Skotnicki,
F. Leverd,
D. Dutartre,
2008,
IEEE Transactions on Nanotechnology.
V. Fiori,
E. Deloffre,
R. Gonella,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
L. Arnaud,
E. Deloffre,
A. Farcy,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
C. Laviron,
Stephane Monfray,
Claire Fenouillet-Beranger,
2009,
ESSDERC 2009.
Electrical properties in low temperature range (5K-300K) of Tantalum Oxide dielectric MIM capacitors
Serge Blonkowski,
Gérard Ghibaudo,
Emilie Deloffre,
2005,
Microelectron. Reliab..
E. Deloffre,
A. Jouve,
S. Lhostis,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
E. Deloffre,
A. Safrani,
S. Eisenbach,
2023,
Electronic Components and Technology Conference.
Léa Di Cioccio,
E. Deloffre,
Loic Sanchez,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
E. Deloffre,
E. Souchier,
S. Moreau,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
E. Deloffre,
J. Swerts,
M. Gros-Jean,
2007,
2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference.