D. Yang

发表

High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

S. Narasimha, K. Onishi, H. Nayfeh, 2006, 2006 International Electron Devices Meeting.

Extremely thin SOI (ETSOI) CMOS with record low variability for low power system-on-chip applications

L. H. Vanamurth, D. Yang, T. Adam, 2009, 2009 IEEE International Electron Devices Meeting (IEDM).

LOCx2-130, a low-power, low-latency, 2 × 4.8-Gbps serializer ASIC for detector front-end readout

C. Liu, Jingbo Ye, A. C. Xiang, 2018, Journal of Instrumentation.

Challenges and opportunities of extremely thin SOI (ETSOI) CMOS technology for future low power and general purpose system-on-chip applications

B. Jagannathan, N. Loubet, P. Kulkarni, 2010, Proceedings of 2010 International Symposium on VLSI Technology, System and Application.