F. Inoue
发表
Eric Beyne,
Dave Thomas,
Anne Jourdain,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
A. Jourdain,
F. Inoue,
E. Beyne,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
M. H. van der Veen,
F. Inoue,
S. Van Huylenbroeck,
2015,
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).
F. Inoue,
H. Philipsen,
Y. Civale,
2013
.
A. Jourdain,
F. Inoue,
K. Rebibis,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
F. Inoue,
H. Philipsen,
Y. Civale,
2012,
2012 IEEE International Interconnect Technology Conference.
W. Li,
A. Vandooren,
Liesbeth Witters,
2018,
2018 International Conference on IC Design & Technology (ICICDT).
F. Inoue,
D. Mocuta,
N. Collaert,
2017,
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
F. M. Bufler,
F. Inoue,
R. Ritzenthaler,
2018,
IEEE Transactions on Electron Devices.
B. Parvais,
A. Vandooren,
G. Hellings,
2018,
2018 IEEE Symposium on VLSI Technology.
F. Inoue,
K. Rebibis,
Andy Miller,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
A. Jourdain,
F. Inoue,
K. Rebibis,
2017
.
F. Inoue,
E. Beyne,
V. Cherman,
2015
.
F. Inoue,
Andy Miller,
G. Beyer,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A. Jourdain,
F. Inoue,
Andy Miller,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
F. Inoue,
Andy Miller,
G. Beyer,
2019,
ECS Journal of Solid State Science and Technology.
A. Jourdain,
F. Inoue,
K. Rebibis,
2018
.
Hiroshi Miyake,
Fumihiro Inoue,
Tomohiro Shimizu,
2011
.
F. Inoue,
K. Vandersmissen,
H. Philipsen,
2017
.
F. Inoue,
T. Shimizu,
S. Shingubara,
2012
.
Herbert Struyf,
Fumihiro Inoue,
Stefaan Van Huylenbroeck,
2015
.
Herbert Struyf,
Fumihiro Inoue,
Stefaan Van Huylenbroeck,
2014
.
F. Inoue,
H. Philipsen,
A. Radisic,
2012
.
Fumihiro Inoue,
Tomohiro Shimizu,
Ryohei Arima,
2013,
2013 IEEE International 3D Systems Integration Conference (3DIC).
Hiroshi Miyake,
Fumihiro Inoue,
Tomohiro Shimizu,
2013
.
Tetsu Tanaka,
Fumihiro Inoue,
Herbert Struyf,
2014,
2014 International 3D Systems Integration Conference (3DIC).
F. Inoue,
E. Beyne,
J. de Vos,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
F. Inoue,
T. Shimizu,
S. Shingubara,
2012
.
Mitsumasa Koyanagi,
Takafumi Fukushima,
Kazuhiro Yamamoto,
2009
.
F. Inoue,
K. Rebibis,
G. Beyer,
2019,
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
B. Parvais,
A. Vandooren,
J. Ryckaert,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
F. Inoue,
S. Shingubara,
Takuya Yamaguchi,
2012
.
F. Inoue,
E. Beyne,
J. Derakhshandeh,
2021,
International Conference on Electronics Packaging.
F. Inoue,
G. Beyer,
E. Beyne,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
F. Inoue,
E. Beyne,
A. Phommahaxay,
2022,
The International Journal of Advanced Manufacturing Technology.
F. Inoue,
A. Uedono,
A. Kawai,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
F. Inoue,
Andy Miller,
G. Beyer,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
F. Inoue,
E. Beyne,
M. Lofrano,
2021
.
F. Inoue,
K. Rebibis,
E. Beyne,
2020
.
A. Jourdain,
J. D. Vos,
F. Inoue,
2017
.
F. Inoue,
G. Beyer,
E. Beyne,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
F. Inoue,
E. Beyne,
Soon-Wook Kim,
2021,
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
F. Inoue,
G. Beyer,
E. Beyne,
2018,
2018 IEEE International Interconnect Technology Conference (IITC).
F. Inoue,
E. Beyne,
Soon-Wook Kim,
2021,
IEEE Electron Device Letters.
F. Inoue,
T. Iwata,
Junya Fuse,
2023,
2023 International Conference on Electronics Packaging (ICEP).
F. Inoue,
G. Beyer,
E. Beyne,
2023,
ECS Journal of Solid State Science and Technology.
Eric Beyne,
Alain Phommahaxay,
Samuel Suhard,
2019,
2019 International 3D Systems Integration Conference (3DIC).
F. Inoue,
Andy Miller,
E. Beyne,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Teng Wang,
Eric Beyne,
Anne Jourdain,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
Kohei Ohta,
Fumihiro Inoue,
Tomohiro Shimizu,
2015
.