Andy Miller
发表
Eric Beyne,
Dave Thomas,
Anne Jourdain,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
Eric Beyne,
Erik Jan Marinissen,
Mirko Scholz,
2015,
2015 International 3D Systems Integration Conference (3DIC).
O. O. Okudur,
Andy Miller,
G. Beyer,
2017,
2017 IEEE International Electron Devices Meeting (IEDM).
A. Jourdain,
K. Rebibis,
Andy Miller,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Andy Miller,
E. Beyne,
C. Adelmann,
2020,
2020 IEEE Symposium on VLSI Technology.
Andy Miller,
G. Beyer,
E. Beyne,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
A. Jourdain,
F. Inoue,
K. Rebibis,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Yesica R. R. Bustamante,
Andy Miller,
P. Absil,
2018,
2018 SBFoton International Optics and Photonics Conference (SBFoton IOPC).
Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs
Eric Beyne,
Andy Miller,
Gerald Beyer,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
K. Rebibis,
Andy Miller,
G. Beyer,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
K. Rebibis,
Andy Miller,
G. Beyer,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
F. Inoue,
K. Rebibis,
Andy Miller,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Andy Miller,
R. Daily,
G. Capuz,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
A. Jourdain,
F. Inoue,
K. Rebibis,
2017
.
Eric Beyne,
Erik Jan Marinissen,
Andy Miller,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
K. Rebibis,
Andy Miller,
G. Beyer,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
K. Rebibis,
Andy Miller,
E. Beyne,
2016
.
F. Inoue,
Andy Miller,
G. Beyer,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A. Jourdain,
F. Inoue,
Andy Miller,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
F. Inoue,
Andy Miller,
G. Beyer,
2019,
ECS Journal of Solid State Science and Technology.
A. Jourdain,
F. Inoue,
K. Rebibis,
2018
.
Andy Miller,
G. Beyer,
E. Beyne,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Andy Miller,
G. Beyer,
E. Beyne,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Andy Miller,
Joeri De Vos,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
Eric Beyne,
Mikael Detalle,
Andy Miller,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Gerald Beyer,
Andy Miller,
2015,
2015 International 3D Systems Integration Conference (3DIC).
Eric Beyne,
Andy Miller,
Herbert Struyf,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Andy Miller,
E. Beyne,
C. Adelmann,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Andy Miller,
G. Beyer,
E. Beyne,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Andy Miller,
John Slabbekoorn,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Andy Miller,
G. Beyer,
E. Beyne,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Andy Miller,
G. Beyer,
E. Beyne,
2018,
2018 IEEE International Interconnect Technology Conference (IITC).
Andy Miller,
R. Gronheid,
D. La Tulipe,
2022,
Advanced Lithography.
A. Jourdain,
Andy Miller,
G. Beyer,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Francesco Testa,
Xin Yin,
Johan Bauwelinck,
2018,
OPTO.
Mireille Maenhoudt,
Andy Miller,
Patrick Wong,
2009,
Lithography Asia.
Andy Miller,
G. Beyer,
E. Beyne,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
S. H. Sharifi,
K. Rebibis,
Andy Miller,
2017,
2017 IEEE International Interconnect Technology Conference (IITC).
Andy Miller,
E. Beyne,
M. Kotelyanskii,
2019,
International Symposium on Microelectronics.
Eric Beyne,
Erik Jan Marinissen,
Anne Jourdain,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Eric Beyne,
Anne Jourdain,
Andy Miller,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Andy Miller,
G. Beyer,
E. Beyne,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A. Jourdain,
K. Rebibis,
Andy Miller,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
A. Jourdain,
Andy Miller,
G. Beyer,
2012,
2012 4th Electronic System-Integration Technology Conference.
Eric Beyne,
Rama Puligadda,
Anne Jourdain,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
Andy Miller,
E. Beyne,
J. Slabbekoorn,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
K. Rebibis,
Andy Miller,
G. Beyer,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
K. Rebibis,
Andy Miller,
E. Beyne,
2015,
2015 IEEE CPMT Symposium Japan (ICSJ).
Andy Miller,
E. Beyne,
J. Slabbekoorn,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Andy Miller,
J. Slabbekoorn,
W. Flack,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Andy Miller,
J. Slabbekoorn,
W. Flack,
2017,
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Andy Miller,
E. Beyne,
J. Slabbekoorn,
2023,
Electronic Components and Technology Conference.
F. Inoue,
Andy Miller,
G. Beyer,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
A. Jourdain,
J. D. Vos,
F. Inoue,
2017
.
F. Inoue,
Andy Miller,
E. Beyne,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Andy Miller,
J. Slabbekoorn,
W. Flack,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Eric Beyne,
Sandip Halder,
Mireille Maenhoudt,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
Teng Wang,
Eric Beyne,
Anne Jourdain,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
K. Rebibis,
Andy Miller,
E. Beyne,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).