J. de Vos

发表

A. Jourdain, F. Inoue, E. Beyne, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

G. Beyer, E. Beyne, J. de Vos, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

G. Beyer, E. Beyne, J. de Vos, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

G. Beyer, E. Beyne, J. de Vos, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

J. de Vos, L. Haspeslagh, M. Lorenzini, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

J. de Vos, I. Debusschere, D. Wellekens, 2008, ESSDERC 2008 - 38th European Solid-State Device Research Conference.

E. Beyne, J. de Vos, Soon-Wook Kim, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

E. Beyne, J. de Vos, S. Van Huylenbroeck, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A. Jourdain, F. Inoue, Andy Miller, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Andy Miller, G. Beyer, E. Beyne, 2022, 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

Andy Miller, G. Beyer, E. Beyne, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

F. Inoue, E. Beyne, J. de Vos, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Andy Miller, G. Beyer, E. Beyne, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Andy Miller, G. Beyer, E. Beyne, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

A. Jourdain, Andy Miller, G. Beyer, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

E. Beyne, J. De Vos, C. Gerets, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Eric Beyne, Ingrid De Wolf, Mario Gonzalez, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Eric Beyne, Anne Jourdain, Andy Miller, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

E. Beyne, J. de Vos, V. Cherman, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

F. Inoue, G. Beyer, E. Beyne, 2017, 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

F. Inoue, G. Beyer, E. Beyne, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

Eric Beyne, Mario Gonzalez, Luka Kljucar, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

G. Beyer, E. Beyne, J. de Vos, 2017, 2017 International Conference on Electronics Packaging (ICEP).