P. Jansen

Substrate bonding techniques for CMOS processed wafers

S. V. D. Groen, M. Rosmeulen, K. Baert, 1997 .

Direct measurement of l/sub eff/ and channel profile in MOSFETs using 2-D carrier profiling techniques

P. Jansen, K. De Meyer, S. Biesemans, 1998, International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).

Resonant tunnelling structures with very thin contact layers using nonalloyed Ge/Pd contacts

P. Jansen, C. Hoof, G. Borghs, 1990 .

Migration of Si in molecular‐beam epitaxial growth of δ‐doped GaAs and Al0.25Ga0.75As

P. Jansen, G. Borghs, M. Meuris, 1990 .

Practicalities and limitations of scanning capacitance microscopy for routine integrated circuit characterization

P. Jansen, W. Vandervorst, P. Wolf, 2000 .

Modeling the subthreshold swing in MOSFET's

L. Deferm, P. Jansen, P. Jansen, 1997, IEEE Electron Device Letters.

Recent Advances in Microfabrication

P. Jansen, M. Rossum, W. Raedt, 1990 .

Impact of Processing Parameters on Leakage Current and Defect Behavior of n + p Silicon Junction Diodes

P. Jansen, L. Deferm, E. Simoen, 1999 .

CH4/H2 reactive ion etching for gate recessing of pseudomorphic modulation doped field effect transistors

P. Jansen, G. Borghs, R. Jonckheere, 1991 .

New aspects of nanopotentiometry for complementary metal–oxide–semiconductor transistors

P. Jansen, W. Vandervorst, R. Stephenson, 2000 .

CMOS compatible wafer scale adhesive bonding for circuit transfer

L. Deferm, P. Jansen, M. Rosmeulen, 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).