K. Leong

发表

Patricia E. Gharagozloo, Todd R. Tritcak, Y. Tolmachev, 2009 .

K. K. Wong, Kin Keong Wong, K. Leong, 2018, International Journal of Heat and Mass Transfer.

K. Leong, T. Wong, J. Y. Ho, 2021, Thermal Science and Engineering Progress.

K. Leong, J. Chai, L. Jin, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

K. Leong, L. Jin, 2006, IEEE Transactions on Components and Packaging Technologies.

K. Leong, K. Ng, B. Saha, 2011 .

Y. S. See, K. Leong, 2019, International Journal of Thermal Sciences.

K. Leong, Xiao-Yang Huang, C. Liu, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

K. K. Wong, Kin Keong Wong, K. Leong, 2019, Applied Thermal Engineering.

K. Leong, T. Wong, J. Y. Ho, 2019, International Journal of Heat and Mass Transfer.

K. Leong, J. Chai, Liwen Jin, 2008, 2008 Second International Conference on Thermal Issues in Emerging Technologies.

K. Leong, J. Y. Ho, X.W. Wang, 2018, International Journal of Heat and Mass Transfer.

P. Sheng, J. Mattis, W. DiScipio, 1996, Proceedings of the 1996 IEEE International Symposium on Electronics and the Environment. ISEE-1996.

Chun Yang, Kai Choong Leong, K. Leong, 2008, Journal of nanoscience and nanotechnology.