Xinxin Li

T. Ono, M. Esashi, Yuelin Wang, 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).

Detection of trace organophosphorus vapor with a self-assembled bilayer functionalized SiO2 microcantilever piezoresistive sensor.

Songlin Feng, Tiantian Yang, Peng Li, 2006, Analytica chimica acta.

Trace TNT Vapor Detection with an SAM-functionalized Piezoresistive SiO2 Microcantilever

Songlin Feng, Peng Li, Yuelin Wang, 2006, 2006 5th IEEE Conference on Sensors.

Fabrication of the Isolated Nano-beams in the Normal (111) Si Wafers with KOH Etching

Xinxin Li, Yuelin Wang, Tie Li, 2006, 2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems.

Fabrication oftheIsolated Nano-beams inthe Normal(111) SiWaferswithKOH Etching

Xinxin Li, Yuelin Wang, Yongliang Yang, 2006 .

Micro IR Spectrometer Based on Blaze Grating

Xinxin Li, Yuelin Wang, Tie Li, 2007, 2007 IEEE Sensors.

Micromachined high-performance RF passives in CMOS substrate

Xinxin Li, Lei Gu, Zhengzheng Wu, 2016 .

A MEMS device for in-situ TEM test of SCS nanobeam

Xinxin Li, Yuelin Wang, Tie Li, 2008 .

Three-solenoid windings transformer baluns on CMOS-grade silicon substrate

Xinxin Li, W. Yin, Zhengzheng Wu, 2010 .

Study of humidity properties of Zinc Oxide modified Porous Silicon

Xinxin Li, Jian Zhang, Xiaofeng Zhou, 2006, 2006 5th IEEE Conference on Sensors.

A novel fabrication process of MEMS devices on polyimide flexible substrates

Lufeng Che, Suyan Xiao, Xinxin Li, 2008 .

A heater-integrated scanning probe microscopy probe array with different tip radii for study of micro-nanosize effects on silicon-tip/polymer-film friction.

Xinxin Li, Haifei Bao, 2008, The Review of scientific instruments.

Micromachined bar-structure gyroscope with high Q-factors for both driving and sensing mode at atmospheric pressure

Jiwei Jiao, Lufeng Che, Bin Xiong, 2003, Proceedings of IEEE Sensors 2003 (IEEE Cat. No.03CH37498).

A micromachining technology for integrating low-loss GHz RF passives on non-high-resistivity low-cost silicon MCM substrate

Zhengzheng Wu, Xinxin Li, Zhengzheng Wu, 2010 .

AFM probes fabricated with masked–maskless combined anisotropic etching and p+ surface doping

Xinxin Li, Yuelin Wang, F. Feng, 2006 .

Monolithic Composite “Pressure + Acceleration + Temperature + Infrared” Sensor Using a Versatile Single-Sided “SiN/Poly-Si/Al” Process-Module

Chen Yang, Hong Zhou, Wei Zhou, 2013, Sensors.

An Axial-beam Piezoresistive Accelerometer for High-performance Crash Detection of Automotive Industry

Songlin Feng, Yuelin Wang, Xinxin Li, 2006, 2006 5th IEEE Conference on Sensors.

A cost-effective flexible MEMS technique for temperature sensing

Yuelin Wang, Xinxin Li, Lufeng Che, 2007, Microelectronics Journal.

Nanofabrication based on MEMS technology

Jiwei Jiao, Tie Li, Yuelin Wang, 2006, IEEE Sensors Journal.

(INVITED) High-performance RF passives using post-CMOS MEMS techniques for RF SoC

Lei Gu, Xinxin Li, Zhengzheng Wu, 2008, 2008 IEEE Radio Frequency Integrated Circuits Symposium.

High-performance monolithic triaxial piezoresistive shock accelerometers

Songlin Feng, Xinxin Li, Heng Yang, 2008 .

A high-sensitivity piezoresistive gyroscope with torsional actuation and axially-stressed detection

Jiwei Jiao, Yuelin Wang, Xinxin Li, 2003, Proceedings of IEEE Sensors 2003 (IEEE Cat. No.03CH37498).

High-Performance CMOS-Compatible Solenoidal Transformers With a Concave-Suspended Configuration

Xinxin Li, Lei Gu, Xinxin Li, 2007, IEEE Transactions on Microwave Theory and Techniques.

A Post-CMOS Concave-Suspending MEMS Process in Standard Silicon Wafers for High-Performance Solenoidal-DNA-Configured Micro-Transformers

Lei Gu, Xinxin Li, Lei Gu, 2006, 2006 International Electron Devices Meeting.

Fabrication of Submicron Beams with Galvanic Etch Stop for Si in TMAH

Yuelin Wang, Haitao Cheng, Xinxin Li, 2009, Sensors.

A novel method to fabricate single crystal nano beams with (111)-oriented Si micromachining

Jiwei Jiao, Tie Li, Yongliang Yang, 2008 .

Enhanced solder joint bonding strength of electronic packaging with electrowetting effect

Xinxin Li, Rong Cheng, Kewei Jiang, 2011 .