N. Lee
发表
N. Lee,
P. Bachorik,
Weiping Liu,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
N. Lee,
J. Lau,
2020
.
N. Lee,
J. Lau,
C. Ko,
2017
.
N. Lee,
J. Lau,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Ming Li,
Cao Xi,
2017
.
N. Lee,
P. Bachorik,
Weiping Liu,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
N. Lee,
J. Lau,
2020
.
N. Lee,
Ning‐Cheng Lee,
1997
.
N. Lee,
J. Lau,
2020
.
N. Lee,
R. Ludwig,
C. Fan,
2002
.
N. Lee,
C. Labarbera,
Guangyu Fan,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
N. Lee,
C. Labarbera,
C. Clark,
2018,
International Symposium on Microelectronics.
N. Lee,
J. Lau,
J. Lo,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
N. Lee,
HongWen Zhang,
J. Minter,
2018,
Journal of Electronic Materials.
N. Lee,
Yan Liu,
D. Herron,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
N. Lee,
P. Vianco,
J. Slattery,
1994
.
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
J. Lau,
2020
.
N. Lee,
J. Lau,
2020
.
N. Lee,
2001
.
N. Lee,
2001
.
N. Lee,
Sheng Liu,
Z. Qian,
2021,
International Journal of Damage Mechanics.
N. Lee,
2001
.
John H. Lau,
Ning-Cheng Lee,
N. Lee,
2020
.
John H. Lau,
Ning-Cheng Lee,
John Lau,
2002
.
N. Lee,
M. Jozefowicz,
1993
.
Ning-Cheng Lee,
N. Lee,
2001
.
N. Lee,
Ning‐Cheng Lee,
1999
.
N. Lee,
W. B. O'Hara,
1995
.
N. Lee,
H. Hwang,
Benlih Huang,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
N. Lee,
Min Ding,
Weiping Liu,
2009,
2009 11th Electronics Packaging Technology Conference.
N. Lee,
2001
.
N. Lee,
2009
.
N. Lee,
J. Lau,
2020
.
Ning-Cheng Lee,
Min Ding,
N. Lee,
2009,
2009 59th Electronic Components and Technology Conference.
Ning-Cheng Lee,
N. Lee,
Weiping Liu,
2007
.
Yi-Shao Lai,
Ying-Ta Chiu,
Jenn-Ming Song,
2012,
Microelectron. Reliab..
N. Lee,
J. Lau,
J. Pang,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
N. Lee,
Hui Li,
Guoyou Liu,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
2012
.
Ning-Cheng Lee,
N. Lee,
2000
.
N. Lee,
C. Labarbera,
Sihai Chen,
2019,
International Symposium on Microelectronics.
N. Lee,
W. B. O'Hara,
N.‐C. Lee,
1995
.
N. Lee,
C. Labarbera,
Sihai Chen,
2016
.
N. Lee,
C. Labarbera,
Sihai Chen,
2014
.
N. Lee,
HongWen Zhang,
2012,
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
N. Lee,
HongWen Zhang,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
N. Lee,
HongWen Zhang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
N. Lee,
HongWen Zhang,
2012
.
N. Lee,
HongWen Zhang,
2012
.
N. Lee,
Y. Lai,
Jenn-Ming Song,
2008,
2008 10th Electronics Packaging Technology Conference.
N. Lee,
C. Labarbera,
Sihai Chen,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
N. Lee,
C. Labarbera,
Sihai Chen,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Sihai Chen,
Ning-Cheng Lee,
N. Lee,
2012,
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
N. Lee,
A. Dasgupta,
E. Zito,
2017
.
N. Lee,
Benlih Huang,
N.-C. Lee,
1999
.
Ning-Cheng Lee,
N. Lee,
W. B. Hance,
1993
.
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
Lin Jin,
J. Lo,
2018,
International Symposium on Microelectronics.
John H. Lau,
Ming Li,
Cao Xi,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
2001
.
High Temperature Lead‐Free Bonding Materials – The Need, the Potential Candidates and the Challenges
N. Lee,
HongWen Zhang,
2020
.