A. Dangol

Gate-all-around MOSFETs based on vertically stacked horizontal Si nanowires in a replacement metal gate process on bulk Si substrates

H. Mertens, R. Ritzenthaler, A. Hikavyy, 2016, 2016 IEEE Symposium on VLSI Technology.

Vertically stacked gate-all-around Si nanowire CMOS transistors with dual work function metal gates

H. Mertens, R. Ritzenthaler, A. Hikavyy, 2016, 2016 IEEE International Electron Devices Meeting (IEDM).

Thermal and plasma treatments for improved (sub-)1 nm equivalent oxide thickness planar and FinFET-based replacement metal gate high-k last devices and enabling a simplified scalable CMOS integration scheme

S. Chew, T. Schram, K. Devriendt, 2014 .

Novel high-precision micropipette thermal sensor for materials thermal characterizations

A. Dangol, T. Choi, R. Shrestha, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Vertically Stacked Gate-All-Around Si Nanowire CMOS Transistors with Reduced Vertical Nanowires Separation, New Work Function Metal Gate Solutions, and DC/AC Performance Optimization

H. Mertens, R. Ritzenthaler, M. Kim, 2018, 2018 IEEE International Electron Devices Meeting (IEDM).

12-EUV Layer Surrounding Gate Transistor (SGT) for Vertical 6-T SRAM: 5-nm-class Technology for Ultra-Density Logic Devices

D. Mocuta, J. Mitard, F. Masuoka, 2019, 2019 Symposium on VLSI Technology.

Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

A. Hikavyy, S. Chew, G. Mannaert, 2017, 2017 IEEE International Interconnect Technology Conference (IITC).

Replacement Metal Contact Using Sacrificial ILD0 for Wrap Around Contact in Scaled FinFET Technology

S. Chew, K. Devriendt, S. Demuynck, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

Vertically stacked gate-all-around Si nanowire transistors: Key Process Optimizations and Ring Oscillator Demonstration

D. Mocuta, H. Bender, R. Ritzenthaler, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

Thermal Characterization of Austenite Stainless Steel (304) and Cnt Films of Varying Thickness Using Micropipette Thermal Sensors

A. Dangol, 2013 .

Highly scalable effective work function engineering approach for multi-VT modulation of planar and FinFET-based RMG high-k last devices for (Sub-)22nm nodes

E. Simoen, E. Vecchio, H. Bender, 2013, 2013 Symposium on VLSI Technology.