P. Conway

发表

AN INVESTIGATION IN THE USE OF A PRESSURE MAT TO MONITOR TURN PERFORMANCE IN SWIMMING

Paul Conway, Andrew A. West, Bruce Mason, 2012 .

smaRTI—A cyber-physical intelligent container for industry 4.0 manufacturing

Paul Conway, Andrew A. West, Aaron D. Neal, 2019, Journal of Manufacturing Systems.

The Effect of Energy Density and Nb Content on the Microstructure and Mechanical Properties of Selective Laser Melted Ti-(10-30 wt.%) Nb

P. Conway, C. Torres-Sánchez, J. Borgman, 2021, Journal of Materials Engineering and Performance.

Under bump metallisation of fine pitch flip-chip using electroless nickel deposition

P. Conway, D. Hutt, D. Whalley, 2000 .

Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection

P. Conway, D. Hutt, D. Whalley, 2004, IEEE Transactions on Components and Packaging Technologies.

Low frequency induction heating for the sealing of plastic microfluidic systems

P. Conway, Changqing Liu, B. Knauf, 2010 .

Polymer bonding by induction heating for microfluidic applications

P. Conway, Changqing Liu, B. Knauf, 2010, 3rd Electronics System Integration Technology Conference ESTC.

A database system for decision support in low-volume electronics assembly

A A West, P P Conway, D. M. Segura Velandia, 2011 .

Excimer Laser Machining of Fired LTCC for Selectively Metallized Open Channel Structures

P. Conway, D. Hutt, Dilshani Rathnayake-Arachchige, 2013 .

Precision high temperature lead-free solder interconnections by means of high-energy droplet deposition techniques

P. Conway, E. Fu, K. Williams, 2002 .

Reliability issues in Pb-free solder joint miniaturization

P. Conway, Changqing Liu, R. Thomson, 2006 .

Thermal Interface Materials - A Review of the State of the Art

P. Conway, D. Whalley, F. Sarvar, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Corrosion characterization of tin–lead and lead free solders in 3.5 wt.% NaCl solution

P. Conway, Changqing Liu, Dezhi Li, 2008 .

Towards Industrial Internet of Things: Crankshaft Monitoring, Traceability and Tracking Using RFID

P. Conway, A. West, W. Whittow, 2016 .

Adhesion improvement of electroless copper (Cu) thin films deposited on Low Temperature Co-fired Ceramics (LTCC)

P. Conway, D. Hutt, Dilshani Rathnayake-Arachchige, 2012, 2012 4th Electronic System-Integration Technology Conference.

CO2 laser micromachining of optical waveguides for interconnection on circuit boards

P. Conway, D. Hutt, Kai Wang, 2012 .

Polymer Overmoulding for Microfluidic Device Packaging and System Integration

P. J. Palmer, P. Conway, D. Hutt, 2005, Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.

Integration and Packaging of Microsystems by Polymer Overmoulding

P. J. Palmer, P. Conway, D. Hutt, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Effects of the microstructure of copper through-silicon vias on their thermally induced linear elastic mechanical behavior

P. Conway, Zhiheng Huang, Zhiyong Wu, 2014, Electronic Materials Letters.

DEVELOPMENT AND R&D CAPABILITY AT MANUFACTURING SITES: ELECTRONICS MULTINATIONALS IN SINGAPORE AND TAIWAN

Paul Conway, Kevin J. Tilley, K. J. Tilley, 2009 .

Offshore development of electronic products

K. J. Tilley, David J. Williams, P. Conway, 1994 .

Fabrication of Polymer Waveguides by Laser Ablation Using a 355 nm Wavelength Nd:YAG Laser

Kai Wang, P. P. Conway, D. A. Hutt, 2011, Journal of Lightwave Technology.

Microstructure-based multiphysics modeling for semiconductor integration and packaging

P. Conway, Q. Zeng, A. Dinsdale, 2014 .

Glass as a Substrate for High Density Electrical Interconnect

P. Conway, D. Hutt, X. Cui, 2008, 2008 10th Electronics Packaging Technology Conference.

Atomic Scale Kinetics of TSV Protrusion

P. Conway, Zhiheng Huang, Jinxin Liu, 2020 .

Embedded programming and real-time signal processing of swimming strokes

T. Le Sage, A. Bindel, P. P. Conway, 2011 .

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

P. Conway, Zhiheng Huang, Hua Xiong, 2014, IEEE Transactions on Device and Materials Reliability.

Enhanced interfacial adhesion and mechanical performance of lightweight polyurethane foam reinforced with a low content of aligned magnetised short carbon fibres

P. Conway, C. Torres-Sánchez, J. Wang, 2020 .

Laser sintering and patterning of gallium-doped zinc oxide/indium-tin oxide nanoparticle films with tailorable electrical and optical properties

P. Conway, D. Hutt, J. Bowers, 2020 .

Effect of solder bump geometry on the microstructure of Sn–3.5 wt% Ag on electroless nickel immersion gold during solder dipping

P. Conway, Changqing Liu, R. Thomson, 2005 .

Processes for integration of microfluidic based devices

P. Conway, D. Hutt, C. Liu, 2009, 2009 European Microelectronics and Packaging Conference.

Modeling the interdependence of processing and alloy composition on the evolution of microstructure in Sn-based lead-free solders in fine pitch flip chip

P. Conway, Changqing Liu, R. Thomson, 2006, IEEE Transactions on Components and Packaging Technologies.

Business Case Modelling of Large Area Flexible Circuits in the Foresight Vehicle Programme

Paul Conway, Andrew A. West, A. J. Carrott, 2002 .

The effect of surface modification on adhesion of polymer waveguide on flexible substrate

T. Y. Hin, P. Conway, Changqing Liu, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Microstructure and Mechanical Reliability Issues of TSV

P. Conway, Tae-Kyu Lee, Zhiheng Huang, 2020 .

An atomistic study of copper extrusion in through-silicon-via using phase field crystal models

P. Conway, Zhiheng Huang, Zhuojun Hu, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Loughborough University Institutional Repository Performance measurement and KPIs for remanufacturing

Fritz Ulrich Dettmer, P. Conway, A. West, 2018 .

Dispersion and microwave processing of nano-sized ITO powder for the fabrication of transparent conductive oxides

P. Conway, D. Hutt, I. Parkin, 2016 .

Enabling Technologies for Robust Performance Monitoring (P10)

Paul Conway, Robert Harrison, Andrew A. West, 2009 .

Controlling Interfacial Interpenetration of Polymer Waveguide Deposited on Plasma Treated Flexible Substrate

T. Y. Hin, P. Conway, Changqing Liu, 2008, 2008 10th Electronics Packaging Technology Conference.

Integrated in‐plane mirror and multimode waveguide fabrication using 248 nm excimer laser ablation for optical interconnects on PCBs

David R. Selviah, P. Conway, D. Hutt, 2012 .

Electronic Interconnect � Printed Circuit Board � Manufacturing �

David R. Selviah, P. Conway, A. Walker, 2008 .

Microsoft Word-IOT crankshaft_paper_reviewed_resubmission.docx

P. Conway, A. West, W. Whittow, 2016 .

On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel layers

Yang Liu, P. Conway, D. Hutt, 2015 .

A design of experiments Cyber-Physical System for energy modelling and optimisation in end-milling machining

Sarogini Grace Pease, Paul A. Goodall, P. Conway, 2023, Robotics Comput. Integr. Manuf..

Growth and recrystallization of electroplated copper columns

P. Conway, Changqing Liu, Changhai Wang, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Plastic Packaging Using Low Frequency Induction Heating (LFIH) For Microsystems

P. Conway, C. Liu, B. Knauf, 2008, 2008 10th Electronics Packaging Technology Conference.

Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH)

P. Conway, Changqing Liu, B. Knauf, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

An application of autoregressive hidden Markov models for identifying machine operations

Paul Conway, Dimitrios Pantazis, Andrew A. West, 2016 .

The impact of multimodal pore size considered independently from porosity on mechanical performance and osteogenic behaviour of titanium scaffolds.

P. Conway, C. Torres-Sánchez, F. R. Almushref, 2021, Materials science & engineering. C, Materials for biological applications.

Microstructural Considerations for Ultrafine Lead Free Solder Joints

Rachel C. Thomson, Zhiheng Huang, Paul P. Conway, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

P. Conway, Zhiheng Huang, Jinxin Liu, 2020, Journal of Electronic Packaging.

Template-free, microscale dimple patterning of pure titanium surface through anodic dissolution using non-aqueous ethylene glycol-TiCl4 electrolytes

P. Conway, C. Torres-Sánchez, J. Borgman, 2020 .

Kinetic Monte Carlo simulation of the electrodeposition of polycrystalline copper: Effects of substrates and deposition parameters on the microstructure of deposits

P. Conway, Jun Liu, Changqing Liu, 2013 .

Observations of solder paste reflow by means of electrical measurements

P. Conway, D. Hutt, D. Whalley, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Characterisation of intermetallics and mechanical behaviour in the reaction between SnAgCu and Sn-Pb solder alloys

P. Conway, Changqing Liu, R. Thomson, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).

Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys

P. Conway, Changqing Liu, R. Thomson, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Multiscale Microstructures and Microstructural Effects on the Reliability of Microbumps in Three-Dimensional Integration

P. Conway, F. Altmann, Zhiheng Huang, 2013, Materials.

Effects of microstructure on vacancy and stress distributions in micro joints under current stressing

P. Conway, Hua Xiong, Zhiheng Huang, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

Addition of Sn to TiNb alloys to improve mechanical performance and surface properties conducive to enhanced cell activity.

P. Conway, C. Torres-Sánchez, Jing Wang, 2020, Materials science & engineering. C, Materials for biological applications.

Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics

Paul Conway, Vadim V. Silberschmidt, Jicheng Gong, 2006 .

Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate

P. Conway, V. Silberschmidt, Changqing Liu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

The effect of pore size and porosity on mechanical properties and biological response of porous titanium scaffolds.

P. Conway, C. Torres-Sánchez, Y. Liu, 2017, Materials science & engineering. C, Materials for biological applications.

Thermo-mechanical properties and regression models of alloys: AISI 305, CK 60, CuBe2 and Laiton MS 63

P. Conway, F. Sarvar, X. Tan, 2005 .

Microstructural and Reliability Issues of TSV

Paul Conway, Indranath Dutta, Praveen Kumar, 2017 .

Formation of Ag3Sn plates in SnAgCu solder bumps

P. Conway, V. Silberschmidt, Changqing Liu, 2010 .

Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder

P. Conway, V. Silberschmidt, Changqing Liu, 2009 .

The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass.

P. Conway, J. Petzing, R. Leach, 2012 .

Integrated optical and electronic interconnect PCB manufacturing research

Ioannis Papakonstantinou, David J. Ives, Paul Conway, 2010 .

Innovative Optical and Electronic Interconnect Printed Circuit Board Manufacturing research

P.P. Conway, David R. Selviah, H. Suyal, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Integrated optical and electronic interconnect printed circuit board manufacturing

Kai Wang, Paul Conway, David A. Hutt, 2008 .

The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications

P. Conway, J. Petzing, R. Leach, 2012 .

Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

P. Conway, D. Hutt, X. Cui, 2012 .

Combining business process and failure modelling to increase yield in electronics manufacturing

Paul Conway, Andrew A. West, Radmehr P. Monfared, 2011 .

In-silico design and experimental validation of TiNbTaZrMoSn to assess accuracy of mechanical and biocompatibility predictive models.

P. Conway, C. Torres-Sánchez, J. Wang, 2021, Journal of the mechanical behavior of biomedical materials.

Design and Implementation of an Integrated Performance Monitoring Tool for Swimming to Extract Stroke Information at Real Time

Andrew A. West, Nandini Chakravorti, Paul P. Conway, 2013, IEEE Transactions on Human-Machine Systems.

A generalized computational interface for combined thermodynamic and kinetic modeling

Paul Conway, Zhiheng Huang, Hua Xiong, 2011 .

Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

P. Conway, V. Silberschmidt, Changqing Liu, 2009 .

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

C. Liu, P. Conway, D. Hutt, 2008, IEEE Transactions on Components and Packaging Technologies.

Crystallographic Features of Copper Column Growth by Reversible Pulse Current Electrodeposition

P. Conway, Changqing Liu, Jun Liu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

P. Conway, V. Silberschmidt, Changqing Liu, 2007 .

Novel approach to reflow oven design to control and optimise lead free soldering process

P.P. Conway, A.A. West, R.P. Monfared, 2006, 2006 8th Electronics Packaging Technology Conference.

Analysis of Stress Distribution in SnAgCu Solder Joint

P. Conway, V. Silberschmidt, C. Liu, 2006 .

Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints

P. Conway, V. Silberschmidt, Changqing Liu, 2006, 56th Electronic Components and Technology Conference 2006.

Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures

P. Conway, Changqing Liu, Dezhi Li, 2006 .

Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

P. Conway, Changqing Liu, Dezhi Li, 2005 .

Interfacial reactions between Pb-free solders and metallized substrate surfaces

P. Conway, Changqing Liu, Dezhi Li, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects

Paul Conway, Dezhi Li, Changqing Liu, 2005 .

Micromechanical characterisation of Sn-Ag-Cu solder FCOB interconnects at ambient and elevated temperatures

P. Conway, Changqing Liu, Dezhi Li, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

P. Conway, Changqing Liu, M. Hendriksen, 2004 .

Inter-dependence of processing and alloy composition on the reliability of Sn-based lead free solders in fine pitch FCOB interconnection

Paul Conway, Rachel C. Thomson, Zhiheng Huang, 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

Characterisation of intermetallic Ag\ing in flip chip solder bumps

P. Conway, Dezhi Li, C. Liuf, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

Paul Conway, Vadim V. Silberschmidt, Jicheng Gong, 2009 .

Impacts of Pb-free legislation on European HDP

P. Conway, Zhiheng Huang, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

Paul Conway, Vadim V. Silberschmidt, Jicheng Gong, 2008 .

Surface characterisation of plasma treated flexible substrates for waveguide-on-flex application

T. Y. Hin, P. Conway, Changqing Liu, 2009 .

Solder paste reflow modeling for flip chip assembly

P. Conway, C. Bailey, D. Hutt, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints

P. Conway, Changqing Liu, R. Thomson, 2004 .

Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver

Paul Conway, David C. Whalley, P. Conway, 1996 .

Manufacture of a human mesenchymal stem cell population using an automated cell culture platform

David J. Williams, Yang Liu, Amit Chandra, 2007, Cytotechnology.

Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections

P. Conway, Zhiheng Huang, R. Qin, 2008 .

Mesomechanical modelling of SnAgCu solder joints in flip chip

Paul Conway, Vadim V. Silberschmidt, Jicheng Gong, 2008 .

The Evolution of Pd ∕ Sn Catalytic Surfaces in Electroless Copper Deposition

P. Conway, D. Hutt, D. Scurr, 2011 .

An investigation of electroless copper films deposited on glass

P. Conway, D. Hutt, X. Cui, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Electrochemical removal of secondary roughness on Selective Laser Melted Titanium with an ethylene-glycol-based electrolyte

P. Conway, C. Torres-Sánchez, B. Moore, 2023, Materials letters (General ed.).

Countermovement jump performance in elite male and female sprinters and high jumpers

L. K. Philpott, P. Conway, A. West, 2020, Proceedings of the Institution of Mechanical Engineers, Part P: Journal of Sports Engineering and Technology.

Comparison of Selective Laser Melted Commercially Pure Titanium Sheet‐Based Triply Periodic Minimal Surfaces and Trabecular‐Like Strut‐Based Scaffolds for Tissue Engineering

P. Conway, C. Torres-Sánchez, J. Borgman, 2021, Advanced Engineering Materials.

Processing-Structure-Protrusion Relationship of 3-D Cu TSVs: Control at the Atomic Scale

P. Conway, Zhiheng Huang, Jinxin Liu, 2019, IEEE Journal of the Electron Devices Society.

Investigation of the Adhesion of Electroless Copper to Glass Substrates

P. Conway, D. Hutt, X. Cui, 2008 .

Developing augmented reality capabilities for industry 4.0 small enterprises: Lessons learnt from a content authoring case study

Andrew A. West, Murray Sinclair, Paul P. Conway, 2020, Comput. Ind..

Copper Deposition and Patterning for Glass Substrate Manufacture

P. Conway, D. Hutt, K. Williams, 2007, 2007 9th Electronics Packaging Technology Conference.

Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activation

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Challenges in the Manufacture of Glass Substrates for Electrical and Optical Interconnect

P. Conway, D. Hutt, K. Williams, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Kinetic Monte Carlo simulation of kinetically limited copper electrocrystallization on an atomically even surface

Paul Conway, Jun Liu, Changqing Liu, 2009 .

A case-based reasoning approach for low volume, high added value electronics

P.P. Conway, A.A. West, D.C. Whalley, 2006, 2006 8th Electronics Packaging Technology Conference.

New lifecycle monitoring system for electronic manufacturing with embedded wireless components

Paul Conway, Andrew A. West, Axel Bindel, 2010 .

Design and Manufacture by Foreign Electronics Multi-Nationals in Singapore and Taiwan: Product Responsibilities in a Global Environment

David J. Williams, Paul Conway, K. J. Tilley, 1996 .

Towards industrial internet of things

Paul Conway, William G. Whittow, Andrew A. West, 2016 .

Complex Low Volume Electronics Simulation Tool to Improve Yield and Reliability

Andrew A. West, Paul P. Conway, Diana M. Segura Velandia, 2007, 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.

Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Business Process Modelling and its Use Within an Elite Training Environment (P15)

Paul Conway, Robert Harrison, Andrew A. West, 2008 .

Fabrication of a Polymeric Optical Waveguide-On-Flex Using Electrostatic-Induced Lithography

T. Y. Hin, P. Conway, M. Desmulliez, 2010, IEEE Photonics Technology Letters.

Characterizing the swimming tumble turn using acceleration data

A A West, S E Slawson, L M Justham, 2012 .

Dynamic signature for tumble turn performance in swimming

Paul Conway, Andrew A. West, Laura M. Justham, 2010 .

A multi‐electrode array (MEA) biochip with excimer laser‐produced micro‐well features

Paul Conway, David A. Hutt, Divya Rajamohan, 2012 .

Fabrication of a novel Multi-Electrode Array (MEA) biochip using polyester insulated electrodes with microwell features for cardiomyocyte analysis

Olivia M Flaherty, Xiaoyun Cui, Divya Rajamohan, 2011, 18th European Microelectronics & Packaging Conference.

Characterisation of the Mechanical Bond Strength for Copper on Glass Plating Applications

P. Conway, J. Petzing, R. Leach, 2013 .

Comparison of in-sight and handheld navigation devices toward supporting industry 4.0 supply chains: First and last mile deliveries at the human level.

Paul Conway, Murray Sinclair, Martin Maguire, 2019, Applied ergonomics.

An intelligent real-time cyber-physical toolset for energy and process prediction and optimisation in the future industrial Internet of Things

Andrew A. West, Sarogini Grace Pease, Navjot Kaur, 2018, Future Gener. Comput. Syst..

Productionisation issues for commercialisation of microfluidic based devices

Paul Conway, D. P. Webb, Benedikt J. Knauf, 2009 .

Variation in the line stability of an inkjet printed optical waveguide-applicable material

J. Chappell, P. Conway, D. Hutt, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Physico-chemical characterisation of Ti-Nb-Sn alloys surfaces and their osteogenic properties

P. Conway, C. Torres-Sánchez, L. Zani, 2020 .

Hybrid ToF and RSSI real-time semantic tracking with an adaptive industrial internet of things architecture

Sarogini Grace Pease, Sarogini Grace Pease, Paul P. Conway, 2017, J. Netw. Comput. Appl..

Monitoring the continuous manufacture of a polymeric foam via a thermokinetic-informed acoustic technique

P. Conway, C. Torres-Sánchez, J. Holt, 2021, Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering.

Phase-Field-Crystal Model: A Tool for Probing Atoms in TSV

P. Conway, Zhiheng Huang, Jinxin Liu, 2020 .

Mechanisms of copper protrusion in through-silicon-via structures at the nanoscale

P. Conway, Zhiheng Huang, Jinxin Liu, 2018, Japanese Journal of Applied Physics.

Stencil Printing Technology for Wafer Level Bumping at sub-100 Micron Pitch Using Pb-Free Alloys

C. Liu, P. Conway, M. Desmulliez, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Effects of plies assembling on textile composite cellular structures

P. Conway, Xiaogang Chen, X. Tan, 2007 .

A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies

Paul Conway, F. Sarvar, P. Conway, 1998 .

Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects

P. Conway, Changqing Liu, Zhiheng Huang, 2013, Journal of Electronic Materials.

The use of inorganic process control agents to mill titanium‑niobium powders suitable for the selective laser melting process

P. Conway, C. Torres-Sánchez, J. Borgman, 2022, Powder Technology.

Cyber-physical systems in the re-use, refurbishment and recycling of used electrical and electronic equipment

Paul Conway, Andrew A. West, Paul A. Goodall, 2018 .

Growth mechanism of copper column by electrodeposition for electronic interconnections

P. Conway, Changqing Liu, Jun Liu, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Size and geometry effects on microstructural evolution in Sn microbumps during isothermal aging

P. Conway, Zhiheng Huang, Hua Xiong, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

An atomistic scale study on solidification in ultrafine interconnects

P. Conway, Zhiyong Wu, Zhiheng Huang, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

An industrial evaluation of an Industry 4.0 reference architecture demonstrating the need for the inclusion of security and human components

Andrew A. West, Paul A. Goodall, Paul P. Conway, 2019, Comput. Ind..

Electric bicycles, next generation low carbon transport systems: A survey

P. Conway, A. West, D. Segura-Velandia, 2021 .

Towards a standard for differential scanning calorimetry measurement of solder paste products

P. Conway, F. Sarvar, D.J. Williams, 1995, Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'.

Deployment of a reflow process model to support quality and reliability in PCA manufacturing

A. A. West, L. A. Huertas-Quintero, P. P. Conway, 2010, 2010 12th Electronics Packaging Technology Conference.

Experimental Investigation of the Formation of Surface Mount Solder Joints

David J. Williams, Paul Conway, David J. Williams, 1996 .

Root cause analysis support for quality improvement in electronics manufacturing

Paul Conway, Diana M. Segura-Velandia, Andrew A. West, 2011 .

Linkages between grain structure and protrusion of TSV in 3D packaging

P. Conway, Zhiheng Huang, Jinxin Liu, 2019, 2019 Electron Devices Technology and Manufacturing Conference (EDTM).

Embedding of electronics within thermoplastic polymers using injection moulding technique

Paul Conway, P. J. Palmer, N. J. Teh, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

Cost estimation for remanufacture with limited and uncertain information using case based reasoning

Paul Conway, Andrew A. West, Paul A. Goodall, 2015 .

A Method for Quantification of the Effects of Size and Geometry on the Microstructure of Miniature Interconnects

P. Conway, Zhiheng Huang, Hua Xiong, 2014, Journal of Electronic Materials.

Indium tin oxide nanowires manufactured via printing and laser irradiation

P. Conway, D. Engstrøm, D. Hutt, 2020 .

Product life cycle information management in the electronics supply chain

Paul Conway, Andrew A. West, Axel Bindel, 2012 .

Personalised Controller Strategies for Next Generation Intelligent Adaptive Electric Bicycles

Andrew A. West, Heinz Lugo, Diana M. Segura Velandia, 2021, IEEE Transactions on Intelligent Transportation Systems.

The categorisation of swimming start performance with reference to force generation on the main block and footrest components of the Omega OSB11 start blocks

Nandini Chakravorti, Paul P. Conway, Jodi Cossor, 2013, Journal of sports sciences.

Performance measurement and KPIs for remanufacturing

Paul Conway, Yi Peng, Andrew A. West, 2015 .

Process variables in the reflow soldering of surface mount

P.P. Conway, D.J. Williams, A.C.T. Tang, 1990, 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium.

Challenges in solder assembly technologies

David J. Williams, Paul Conway, David J. Williams, 1998 .

Development of a wireless sensor network for embedded monitoring of human motion in a Harsh environment

Paul Conway, Axel Bindel, Tanya Le Sage, 2011, 2011 IEEE 3rd International Conference on Communication Software and Networks.

A component based integrated system for signal processing of swimming performance

Andrew A. West, Axel Bindel, Paul P. Conway, 2010, 2010 International Conference on Signal Processing and Multimedia Applications (SIGMAP).

Sub-100 micron pitch stencil printing for wafer scale bumping

P. Conway, M. Desmulliez, C. Liu, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

Aerosol-assisted fabrication of tin-doped indium oxide ceramic thin films from nanoparticle suspensions

P. Conway, D. Hutt, I. Parkin, 2016 .

Development of a wireless sensor network for use as an automated system for monitoring swimming starts

Paul Conway, Sian Slawson, Tanya Le Sage, 2013 .

Sustainable production in the UK: a tool to support printed circuit assembly (PCA) manufacturing

Andrew A. West, Emma L. Rosamond, Paul P. Conway, 2013, Int. J. Comput. Integr. Manuf..

A computational interface for thermodynamic calculations software MTDATA

Paul Conway, Rachel C. Thomson, Alan Dinsdale, 2008 .

Development of a system for monitoring performance in the strength and conditioning domain

Paul Conway, L. K. Philpott, Katherine van Lopik, 2021, Proceedings of the Institution of Mechanical Engineers, Part P: Journal of Sports Engineering and Technology.

Assessing wireless inertia measurement units for monitoring athletics sprint performance

Andrew A. West, L. K. Philpott, Paul P. Conway, 2014, IEEE SENSORS 2014 Proceedings.