H. Köck

ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness

Andrea Irace, Stefan Decker, Vladimír Kosel, 2011, Microelectron. Reliab..

Micro-Tesla Offset in Thermally Stable AlGaN/GaN 2DEG Hall Plates Using Current Spinning

Ananth Saran Yalamarthy, H. Köck, D. Senesky, 2018, IEEE Sensors Letters.

Effect of Geometry on Sensitivity and Offset of AlGaN/GaN and InAlN/GaN Hall-Effect Sensors

Ananth Saran Yalamarthy, H. Köck, D. Senesky, 2018, IEEE Sensors Journal.

Sensitivity of 2DEG-based Hall-effect sensors at high temperatures.

H. Köck, D. Senesky, S. Benbrook, 2020, The Review of scientific instruments.

Low Offset and Noise in High Biased GaN 2DEG Hall-Effect Plates Investigated With Infrared Microscopy

Peter F. Satterthwaite, Ananth Saran Yalamarthy, H. Köck, 2020, Journal of Microelectromechanical Systems.

IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures

Dionyz Pogany, Vladimír Kosel, Michael Glavanovics, 2009, Microelectron. Reliab..

Improved thermal management of low voltage power devices with optimized bond wire positions

Dionyz Pogany, Markus Ladurner, Robert Illing, 2011, Microelectron. Reliab..