N. J. Teh

Thermal and thermo-mechanical modelling of polymer overmoulded electronics

David A. Hutt, David C. Whalley, F. Sarvar, 2006 .

STATISTICAL OPTIMISATION OF THERMOPLASTIC INJECTION MOULDING PROCESS FOR THE ENCAPSULATION OF ELECTRONIC SUBASSEMBLY

Paul Conway, P. J. Palmer, N. J. Teh, 2000 .

Design of a turbulence-enhanced deaggregation system for dry powder formulations

Paul Conway, F. Sarvar, N. J. Teh, 2003, Proceedings of the 25th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE Cat. No.03CH37439).

Embedding of electronics within thermoplastic polymers using injection moulding technique

Paul Conway, P. J. Palmer, N. J. Teh, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).