M. Leicht
发表
Wolfgang Fichtner,
Mauro Ciappa,
Maria Stangoni,
2002,
Microelectron. Reliab..
T. Detzel,
M. Leicht,
Rui Huang,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
M. Leicht,
B. Wunderle,
J. Heilmann,
2022,
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
M. Leicht,
B. Wunderle,
J. Heilmann,
2022,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
M. Leicht,
B. Wunderle,
J. Heilmann,
2021,
International Workshop on Thermal Investigations of ICs and Systems.
M. Leicht,
B. Wunderle,
J. Heilmann,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Wolfgang Fichtner,
Mauro Ciappa,
Maria Stangoni,
2004,
Microelectron. Reliab..
M. Leicht,
Jeffrey McCord,
M. Leicht,
1993
.
S. Selberherr,
J. Fugger,
M. Leicht,
2005,
Research in Microelectronics and Electronics, 2005 PhD.