Lizheng Zhang

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Applications Using a Laser Ultrasound Inspection System

I. C. Ume, Jin Yang, Lizheng Zhang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Study of flip chip solder joint cracks under temperature cycling using a laser ultrasound inspection system

I. C. Ume, Lizheng Zhang, J. Gamalski, 2009, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Study of flip chip solder joint cracks under temperature cycling using a laser ultrasound inspection system

I. C. Ume, Lizheng Zhang, J. Gamalski, 2009, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Research on Packaging Evaluation System of Fast Moving Consumer Goods Based on Analytical Hierarchy Process Method

Lizheng Zhang, Jiandong Lu, Hongtao Miao, 2016 .