V. Sundaram
发表
Fuhan Liu,
Venky Sundaram,
Sidharth Dalmia,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Brett M. D. Sawyer,
V. Sundaram,
R. Tummala,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
V. Sundaram,
R. Tummala,
Hao Lu,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Qing Xin Zhang,
D. Kwong,
V. Sundaram,
2009
.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2009,
2009 59th Electronic Components and Technology Conference.
V. Sundaram,
R. Tummala,
Y. Joshi,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
R. Tummala,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Preet M. Singh,
V. Sundaram,
R. Tummala,
2015,
Journal of Materials Science: Materials in Electronics.
V. Sundaram,
R. Tummala,
K. Ramachandran,
2014,
Journal of Materials Science: Materials in Electronics.
D. Kwong,
V. Sundaram,
R. Tummala,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
D. Kwong,
V. Sundaram,
C. Selvanayagam,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
V. Smet,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
B. Lee,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
P.M. Raj,
Lixi Wan,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
V. Sundaram,
R. Tummala,
A. Shorey,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Chandrasekharan Nair,
Venky Sundaram,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2000
.
V. Sundaram,
R. Tummala,
Makoto Kobayashi,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Hao Lu,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
R. Tummala,
2013,
Journal of Electronic Materials.
V. Sundaram,
R. Tummala,
V. Smet,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
R. Tummala,
N. Kumbhat,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
V. Sundaram,
R. Tummala,
N. Kumbhat,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Venky Sundaram,
Rao R. Tummala,
Sangbeom Cho,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Bruce C. S. Chou,
V. Sundaram,
R. Tummala,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
R. Tummala,
Yoichiro Sato,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
V. Sundaram,
R. Tummala,
R. Pucha,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors
V. Sundaram,
R. Tummala,
P. Hesketh,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Bartlet DeProspo,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
V. Smet,
2017
.
An integrated double balanced mixer on multilayer liquid crystalline polymer (M-LCP) based substrate
V. Sundaram,
S. Dalmia,
G. White,
2005,
2005 European Microwave Conference.
V. Sundaram,
Fuhan Liu,
G. White,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
V. Sundaram,
S. Dalmia,
G. White,
2006,
2006 IEEE Radio and Wireless Symposium.
R.R. Tummala,
V. Sundaram,
D. Guidotti,
2004,
IEEE Transactions on Advanced Packaging.
Bruce C. S. Chou,
V. Sundaram,
R. Tummala,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
V. Smet,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
V. Smet,
2016
.
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
V. Sundaram,
R. Tummala,
V. Smet,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
G. White,
2004
.
V. Sundaram,
R. Tummala,
H. Sharma,
2018,
Journal of Electronic Materials.
Rao Tummala,
Venky Sundaram,
Himani Sharma,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
J. Laskar,
A. Sutono,
M.F. Davis,
2001,
2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).
V. Sukumaran,
V. Sundaram,
R. Tummala,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
G. White,
2004
.
Rao Tummala,
Joungho Kim,
Sung Jin Kim,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2001,
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
S. Bhattacharya,
P. Markondeya Raj,
R. Doraiswami,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Rao Tummala,
Bartlet DeProspo,
P. Markondeya Raj,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
R. Tummala,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
P. Raj,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
R.R. Tummala,
V. Sundaram,
P. Markondeya Raj,
2004,
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).
Joungho Kim,
Rao Tummala,
Jihye Kim,
2015,
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Andrew F. Peterson,
Venky Sundaram,
Kadappan Panayappan,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Venky Sundaram,
Markondeya Raj Pulugurtha,
Rao R. Tummala,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Venky Sundaram,
Srikrishna Sitaraman,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Manos M. Tentzeris,
Bijan Tehrani,
Venky Sundaram,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Venky Sundaram,
Sebastian Gottschall,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Rao Tummala,
Fuhan Liu,
Madhavan Swaminathan,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Y. Joshi,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Madhavan Swaminathan,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Rao Tummala,
Fuhan Liu,
George E. White,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2017
.
Characterization of electrical properties of glass and transmission lines on thin glass up to 50 GHz
V. Sundaram,
R. Tummala,
J. Papapolymerou,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
A. Peterson,
V. Sundaram,
R. Tummala,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
A. Kumar,
K. Chandran,
2019,
Journal of Physics: Conference Series.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2018,
Journal of Microelectronics and Electronic Packaging.
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Ryan Bahr,
Rao Tummala,
Venky Sundaram,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Manos M. Tentzeris,
Venky Sundaram,
2017,
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO).
Joungho Kim,
Venky Sundaram,
Jonghyun Cho,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Linghua Kong,
Fuhan Liu,
Fengtao Wang,
2010,
IEEE Transactions on Advanced Packaging.
Collen Z. Leng,
V. Sundaram,
R. Tummala,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
K. Demir,
2017,
IEEE Transactions on Device and Materials Reliability.
V. Sundaram,
R. Tummala,
K. Demir,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Hao Lu,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
P. Raj,
2011,
2011 11th IEEE International Conference on Nanotechnology.
V. Sundaram,
R. Tummala,
P. Raj,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Venky Sundaram,
Qiao Chen,
Rao R. Tummala,
2009,
2009 IEEE Custom Integrated Circuits Conference.