G. White

Process integration for low-cost system on a package (SOP) substrate

Fuhan Liu, Venky Sundaram, Sidharth Dalmia, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Ultra-fine photoresist image formation for next generation high-density PWB substrate

Rao Tummala, Fuhan Liu, Venky Sundaram, 2000 .

Electroless Ni-P/Ni-W-P thin-film resistors for MCM-L based technologies

G. White, R. Tummala, M. Allen, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

An integrated double balanced mixer on multilayer liquid crystalline polymer (M-LCP) based substrate

V. Sundaram, S. Dalmia, G. White, 2005, 2005 European Microwave Conference.

Multi-Layer Organic (MLO™) RF Components - A New Component Option for Harsh Environment RF Automotive Designs

Michael Ulrich, George E. White, Edgardo X. Menendez, 2014 .

Materials, processes and reliability of mixed-signal substrates for SOP technology

V. Sundaram, Fuhan Liu, G. White, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Design of a dual frequency oscillator for simultaneous multi-band radio communication on a multi-layer liquid crystalline polymer substrate

V. Sundaram, S. Dalmia, G. White, 2006, 2006 IEEE Radio and Wireless Symposium.

Simultaneous switching noise suppression for high speed systems using embedded decoupling

Rao Tummala, Madhavan Swaminathan, Venky Sundaram, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Michael Feil, Cliff Adler, Dieter Hemmetzberger. Martin Konig. and Karlheinz Bock - Fraunhofer IZM

V. Sundaram, Fuhan Liu, G. White, 2004 .

RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology

J. Laskar, A. Sutono, M.F. Davis, 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).

Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

V. Sundaram, Fuhan Liu, G. White, 2004 .

Characterization of thin film organic materials at high frequency

Rao Tummala, Madhavan Swaminathan, Venky Sundaram, 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).