R. Tummala
发表
Fuhan Liu,
Venky Sundaram,
Sidharth Dalmia,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Brett M. D. Sawyer,
V. Sundaram,
R. Tummala,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
Xi Liu,
Qiao Chen,
2012,
IEEE Transactions on Device and Materials Reliability.
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
E. J. Rymaszewski,
R. Tummala,
Y. Lee,
1988
.
R. Tummala,
S. Ahmed,
H. Potts,
1991,
1991 Proceedings 41st Electronic Components & Technology Conference.
R. Tummala,
B. Clark,
1992,
1992 Proceedings 42nd Electronic Components & Technology Conference.
Rao Tummala,
R. Tummala,
D. Janagama,
2010
.
R. Tummala,
V. Smet,
Y. Joshi,
2018
.
R. Tummala,
Xi Liu,
Qiao Chen,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
R. Tummala,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
R. Tummala,
M. Swaminathan,
K. Han,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
R. Tummala,
Hao Lu,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
R. Tummala,
V. Sukumaran,
K. Ramachandran,
2018,
Journal of Materials Science: Materials in Electronics.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
R. Tummala,
Xi Liu,
Qiao Chen,
2009,
2009 59th Electronic Components and Technology Conference.
R. Tummala,
M. Sacks,
P. Raj,
2007,
IEEE Transactions on Components and Packaging Technologies.
R. Tummala,
2008
.
R. Tummala,
S. Bhattacharya,
2002
.
Zhong Lin Wang,
R. Tummala,
Jin Liu,
2006,
Nano letters.
Zhong Lin Wang,
R. Tummala,
Xudong Wang,
2008,
Nano letters.
Zhong Lin Wang,
R. Tummala,
Jun Zhou,
2008
.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2009,
2009 59th Electronic Components and Technology Conference.
R. Tummala,
M. Swaminathan,
P. Chakraborti,
2014,
14th IEEE International Conference on Nanotechnology.
R. Tummala,
J. Tsai,
B. Lee,
2006,
56th Electronic Components and Technology Conference 2006.
Rao Tummala,
R. Tummala,
1991
.
Rao Tummala,
Madhavan Swaminathan,
Himani Sharma,
2016,
IEEE Antennas and Wireless Propagation Letters.
Rao Tummala,
Jianmin Miao,
Ritwik Chatterjee,
2008
.
S. Ahmed,
R. Tummala,
S. Ahmed,
1992
.
V. Sundaram,
R. Tummala,
Y. Joshi,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Weiping Li,
R. Tummala,
1997
.
R. Tummala,
Arvind Kumar,
S. Ray,
1993,
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
R. Tummala,
G. Czornyj,
Michael R. Haley,
1993
.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Preet M. Singh,
V. Sundaram,
R. Tummala,
2015,
Journal of Materials Science: Materials in Electronics.
V. Sundaram,
R. Tummala,
K. Ramachandran,
2014,
Journal of Materials Science: Materials in Electronics.
R. Tummala,
S. Bhattacharya,
P. Raj,
2018
.
Rao Tummala,
Himani Sharma,
P. Markondeya Raj,
2013,
Journal of Materials Science: Materials in Electronics.
D. Kwong,
V. Sundaram,
R. Tummala,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Himani Sharma,
P. M. Raj,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
R. Tummala,
P. Chakraborti,
P. Raj,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
R. Tummala,
V. Smet,
K. Demir,
2017
.
V. Sundaram,
R. Tummala,
V. Smet,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Iyer,
A. Tay,
2008,
IEEE Transactions on Advanced Packaging.
R. Tummala,
M. Iyer,
A. Tay,
2006,
56th Electronic Components and Technology Conference 2006.
V. Sundaram,
R. Tummala,
B. Lee,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Swaminathan,
L. Wan,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
R. Tummala,
P. Chakraborti,
H. Sharma,
2017,
Journal of Materials Science: Materials in Electronics.
R. Tummala,
P. Chakraborti,
H. Sharma,
2015,
Journal of Materials Science.
I. R. Abothu,
R. Tummala,
Hiroshi M. Yamamoto,
2012,
Journal of Materials Science: Materials in Electronics.
R. Tummala,
D. Balaraman,
P. Raj,
2011
.
V. Sundaram,
P.M. Raj,
Lixi Wan,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
R. Tummala,
C. Wong,
M. Iyer,
2008,
IEEE Transactions on Electronics Packaging Manufacturing.
R. Tummala,
P. Gangidi,
P. Raj,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
C. Wong,
2000
.
V. Sundaram,
R. Tummala,
A. Shorey,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Chandrasekharan Nair,
Venky Sundaram,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Swaminathan,
M. Kathaperumal,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
R. Tummala,
Joungho Kim,
Kyungjun Cho,
2020,
IEEE Transactions on Microwave Theory and Techniques.
Sajanlal R. Panikkanvalappil,
R. Tummala,
H. Sharma,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
R. Tummala,
V. Smet,
P. Raj,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Swaminathan,
Kazuki Watanabe,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
R. Tummala,
R. B. Shaw,
1987
.
R. Tummala,
P. Markondeya Raj,
H. Sharma,
2016,
Journal of Materials Science: Materials in Electronics.
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2000
.
R. Tummala,
1999
.
V. Sundaram,
R. Tummala,
Makoto Kobayashi,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Rao R. Tummala,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Swaminathan,
P. Raj,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
R. Tummala,
Hao Lu,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
R. Tummala,
2013,
Journal of Electronic Materials.
R. Tummala,
P. Gupta,
R. Doraiswami,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
R. Tummala,
P. Raj,
H. Sharma,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Iyer,
Jin Liu,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
R. Tummala,
M. Swaminathan,
V. Nair,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Swaminathan,
V. Nair,
2014,
The 8th European Conference on Antennas and Propagation (EuCAP 2014).
V. Sundaram,
R. Tummala,
V. Smet,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
S. Sitaraman,
L. Wan,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
K. J. Lee,
R. Tummala,
J. Laskar,
2005
.
G. White,
R. Tummala,
M. Allen,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
Rao Tummala,
Siddharth Ravichandran,
Mohanalingam Kathaperumal,
2019,
International Symposium on Microelectronics.
R. Tummala,
V. Smet,
R. Pulugurtha,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
N. Kumbhat,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
V. Sundaram,
R. Tummala,
N. Kumbhat,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Venky Sundaram,
Rao R. Tummala,
Sangbeom Cho,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Bruce C. S. Chou,
V. Sundaram,
R. Tummala,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
R. Tummala,
Yoichiro Sato,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
R. Tummala,
P. Raj,
H. Sharma,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
R. Tummala,
B. Foster,
1975
.
R. Tummala,
P. Raj,
S. Banerji,
2005,
IEEE Transactions on Advanced Packaging.
R. Tummala,
R. Doraiswami,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
V. Sundaram,
R. Tummala,
R. Pucha,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors
V. Sundaram,
R. Tummala,
P. Hesketh,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Bartlet DeProspo,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
R. Tummala,
R. Pucha,
M. Kathaperumal,
2022,
Journal of the Indian Institute of Science.
V. Sundaram,
R. Tummala,
V. Smet,
2017
.
R. Tummala,
M. Swaminathan,
Hirokazu Ito,
2021,
Applied Physics Letters.
R. Tummala,
C. Wong,
T. S. Troutman,
1999,
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
R. Tummala,
D. Baldwin,
J. Qu,
2000
.
R. Tummala,
Liyi Li,
P. Chakraborti,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
R. Tummala,
G. Chang,
2007
.
R. Tummala,
R. Pucha,
M. Kathaperumal,
2022,
Journal of the Indian Institute of Science.
R. Tummala,
V. Sundaram,
S. Bhattacharya,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
R. Tummala,
Z. Wang,
M. Iyer,
2008,
2008 58th Electronic Components and Technology Conference.
R. Tummala,
Makoto Kobayashi,
V. Smet,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
R. Tummala,
V. Smet,
A. Antoniou,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
R. Tummala,
F. Ayazi,
P. Raj,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Fuhan Liu,
R. Tummala,
G. Chang,
2007,
International Conference on Electronic Packaging Technology.
R. Tummala,
M. Iyer,
D. Hess,
2008,
2008 58th Electronic Components and Technology Conference.
R. Tummala,
M. Iyer,
P. Raj,
2006,
2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.
V. Sundaram,
Fuhan Liu,
G. White,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
R. Tummala,
A. Saxena,
R. Rajoo,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
R. Tummala,
1991
.
R. Tummala,
P. Raj,
H. Sharma,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
V. Smet,
Ting-chia Huang,
2017,
Journal of Electronic Materials.
R. Tummala,
A. Saxena,
W. V. van Driel,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
R. Tummala,
V. Smet,
P. Raj,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
R. Tummala,
A. Tay,
M. Sacks,
2004,
9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..
R. Tummala,
M. Iyer,
P. Raj,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
R. Tummala,
Y. Joshi,
Sangbeom Cho,
2018
.
R. Tummala,
H. Sharma,
M. Pulugurtha,
2016
.
R. Tummala,
R. Pucha,
M. Kathaperumal,
2022,
Journal of the Indian Institute of Science.
Ramón A. Sosa,
R. Tummala,
V. Smet,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Swaminathan,
V. Nair,
2014,
Journal of Electronic Materials.
R. Tummala,
K. Moon,
Maysam Ghovanloo,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Tentzeris,
M. Pulugurtha,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
K. Slenes,
P. Raj,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
H. B. Pogge,
R. Tummala,
Jiali Wu,
2002
.
H. B. Pogge,
R. Tummala,
C. Wong,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
R. Tummala,
P. Raj,
Shreya Dwarakanath,
2018,
2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC).
R. Tummala,
P. Kohl,
D. Balaraman,
2002,
4th Electronics Packaging Technology Conference, 2002..
R. Tummala,
D. Balaraman,
P. Raj,
2007,
IEEE Transactions on Components and Packaging Technologies.
R. Tummala,
E. Shipton,
Devin K. Brown,
2015,
2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO).
Rao Tummala,
S. K Bhattacharya,
R. Tummala,
2001
.
R. Tummala,
R. R. Tummala,
1988
.
Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials
R. Tummala,
P. Raj,
N. Kumbhat,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Zhong Lin Wang,
N. Xu,
R. Tummala,
2007,
Small.
Rao Tummala,
D. Balaraman,
Baik-Woo Lee,
2010
.
Haksun Lee,
Vanessa Smet,
Rao Tummala,
2020,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
R.R. Tummala,
V. Sundaram,
D. Guidotti,
2004,
IEEE Transactions on Advanced Packaging.
Rao Tummala,
Swapan K. Bhattacharya,
R. Tummala,
2000
.
R. Tummala,
D. Balaraman,
M. Sacks,
2004,
9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..
R. Tummala,
Manish Kumar,
P. Raj,
2010
.
Rao Tummala,
R. Tummala,
2001
.
Bruce C. S. Chou,
V. Sundaram,
R. Tummala,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
V. Smet,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
E. Toimil-Molares,
S. Bansal,
R. Tummala,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
V. Sundaram,
R. Tummala,
V. Smet,
2016
.
R. Tummala,
A. Saxena,
W. Driel,
2012
.
R. Tummala,
S. Sitaraman,
Timothy B. Huang,
2017
.
R. Tummala,
D. Seraphim,
William T. Chen,
1997
.
R. Tummala,
M. Iyer,
Jin Liu,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Rao Tummala,
Ashok Saxena,
Hoan-Kee Kim,
2008
.
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
V. Sundaram,
R. Tummala,
V. Smet,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Himani Sharma,
Srikrishna Sitaraman,
2017,
Proceedings of the IEEE.
Rao Tummala,
Himani Sharma,
Srikrishna Sitaraman,
2015
.
V. Sundaram,
Fuhan Liu,
G. White,
2004
.
P. Markondeya Raj,
Sau Wee Koh,
K. Vaidyanathan,
2006,
56th Electronic Components and Technology Conference 2006.
R.R. Tummala,
Baik-Woo Lee,
Jui-Yun Tsai,
2008,
IEEE Transactions on Advanced Packaging.
R. Tummala,
V. Smet,
G. Murtagian,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
V. Smet,
G. Murtagian,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Pulugurtha Markondeya Raj,
Rao Tummala,
Atom O. Watanabe,
2020,
Journal of Electronic Materials.
Dingrong Yi,
Linghua Kong,
Ali Adibi,
2010,
Journal of biomedical optics.
Rao Tummala,
Chong K. Yoon,
Baik-Woo Lee,
2006
.
Muhammad Ali,
P. Markondeya Raj,
Sk Yeahia Been Sayeed,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fuhan Liu,
R. Tummala,
M. Swaminathan,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
H. Sharma,
2018,
Journal of Electronic Materials.
Rao Tummala,
Venky Sundaram,
Himani Sharma,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Tentzeris,
M. Swaminathan,
2019,
2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G).
R. Tummala,
P. Raj,
H. Sharma,
2015,
Journal of Electronic Materials.
Rao R Tummala,
R. Tummala,
2019,
2019 Pan Pacific Microelectronics Symposium (Pan Pacific).
Kyutae Lim,
A. Obatoyinbo,
J. Laskar,
2001,
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
J. Laskar,
A. Sutono,
M.F. Davis,
2001,
2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).
Rao Tummala,
Himani Sharma,
P. Markondeya Raj,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
V. Sukumaran,
V. Sundaram,
R. Tummala,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
G. White,
2004
.
Masaki Fujii,
Petri Savolainen,
Yasushi Gotoh,
2004
.
R. Tummala,
P. Raj,
H. Sharma,
2017,
IEEE Transactions on Magnetics.
Rao Tummala,
Himani Sharma,
P. Markondeya Raj,
2015,
Journal of Materials Science: Materials in Electronics.
Rao Tummala,
Srikrishna Sitaraman,
P. Markondeya Raj,
2014
.
R. Tummala,
M. Swaminathan,
P. Raj,
2012,
IEEE Nanotechnology Magazine.
R. Tummala,
E. Shipton,
P. Raj,
2016,
IEEE Transactions on Magnetics.
Rao Tummala,
Madhavan Swaminathan,
Himani Sharma,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Swaminathan,
V. Nair,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Swaminathan,
V. Nair,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
P. M. Raj,
D. E. Reisner,
L. Wan,
2005
.
Madhavan Swaminathan,
Pulugurtha M. Raj,
Muhammad Ali,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Tentzeris,
V. Smet,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
R. Tummala,
P. Raj,
R. Mullapudi,
2018,
Journal of Electronic Materials.
R. Tummala,
D. Balaraman,
P. Raj,
2003
.
Rao Tummala,
Joungho Kim,
Sung Jin Kim,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
S. Bhattacharya,
P. Markondeya Raj,
R. Doraiswami,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Donald P. Seraphim,
Rao R. Tummala,
R. Tummala,
1989
.
Toshihiko Watari,
Rao Tummala,
E. J. Rymaszewski,
1997
.
Rao Tummala,
R. Tummala,
1990
.
R. Tummala,
M. Tentzeris,
M. Swaminathan,
2020,
IEEE Transactions on Microwave Theory and Techniques.
Madhavan Swaminathan,
Rui Zhang,
Rao R. Tummala,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Madhavan Swaminathan,
Rao R. Tummala,
Hirokazu Ito,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Madhavan Swaminathan,
Siddharth Ravichandran,
2020,
2020 Pan Pacific Microelectronics Symposium (Pan Pacific).
Rao Tummala,
Bartlet DeProspo,
P. Markondeya Raj,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
R. Tummala,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Tentzeris,
M. Swaminathan,
2020,
IEEE Antennas and Wireless Propagation Letters.
R. Tummala,
P. Raj,
A. Aggarwal,
2007,
IEEE Transactions on Advanced Packaging.
V. Sundaram,
R. Tummala,
P. Raj,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
R. Tummala,
A. Saxena,
S. Koh,
2008,
2008 58th Electronic Components and Technology Conference.
R. Tummala,
B. Williams,
H. Sharma,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Manos M. Tentzeris,
Fuhan Liu,
Rao R. Tummala,
2018,
IEEE Microwave and Wireless Components Letters.
R.R. Tummala,
R. Tummala,
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IEEE Transactions on Advanced Packaging.
Rao Tummala,
Madhavan Swaminathan,
Mark G. Allen,
1996,
1996 Proceedings 46th Electronic Components and Technology Conference.
R.R. Tummala,
V. Sundaram,
P. Markondeya Raj,
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Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).
Zhong Lin Wang,
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R. Tummala,
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H. Sharma,
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IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Himani Sharma,
P. Markondeya Raj,
2012,
Journal of Materials Science: Materials in Electronics.
Joungho Kim,
Rao Tummala,
Jihye Kim,
2015,
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Rao Tummala,
Madhavan Swaminathan,
Daehyun Chung,
2009,
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.
Madhavan Swaminathan,
Daehyun Chung,
Rao R. Tummala,
2009,
2009 IEEE International Conference on 3D System Integration.
Joy Laskar,
Rao R. Tummala,
R. Tummala,
2004,
Proceedings of the IEEE.
J. Laskar,
A. Sutono,
R. Tummala,
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IEEE Microwave Magazine.
R. Tummala,
S. Bansal,
A. Saxena,
2005
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R. Tummala,
A. Saxena,
S. Bansal,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
M. Damani,
R. Tummala,
S. Sitaraman,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Antonia Antoniou,
Rao Tummala,
Vanessa Smet,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Pulugurtha Markondeya Raj,
Rao Tummala,
Antonia Antoniou,
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2017 IEEE Applied Power Electronics Conference and Exposition (APEC).
R. Tummala,
M. Swaminathan,
M. Iyer,
2008,
2008 58th Electronic Components and Technology Conference.
C.P. Wong,
M. Swaminathan,
P. Markondeya Raj,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Rao R. Tummala,
John U. Knickerbocker,
Raj N. Master,
1992,
IBM J. Res. Dev..
D. Balaraman,
P. Markondeya Raj,
R. Tummala,
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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Zhong Lin Wang,
W. Mai,
R. Tummala,
2006
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Zhong Lin Wang,
R. Tummala,
Jin Liu,
2005,
2005 6th International Conference on Electronic Packaging Technology.
R. Tummala,
K. Moon,
V. Sundaram,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
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R. Tummala,
P. Raj,
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S. Bhattacharya,
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P. Raj,
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Yuya Suzuki,
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IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Seungtaek Jeong,
Junki Min,
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Andrew F. Peterson,
Venky Sundaram,
Kadappan Panayappan,
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IEEE Transactions on Components, Packaging and Manufacturing Technology.
Venky Sundaram,
Markondeya Raj Pulugurtha,
Rao R. Tummala,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Venky Sundaram,
Srikrishna Sitaraman,
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R.R. Tummala,
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R. Tummala,
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IEEE Transactions on Components, Packaging and Manufacturing Technology.
Manos M. Tentzeris,
Fuhan Liu,
Venkatesh Sundaram,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Tentzeris,
V. Sundaram,
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2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
R. Tummala,
2003
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Manos M. Tentzeris,
Bijan Tehrani,
Venky Sundaram,
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
R. Tummala,
H. Sharma,
S. Gandhi,
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Electronic Components and Technology Conference.
R. Tummala,
V. Sukumaran,
K. Ramachandran,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Rao Tummala,
Venky Sundaram,
Sebastian Gottschall,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Rao Tummala,
Chandrasekharan Nair,
P. Markondeya Raj,
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IEEE Nanotechnology Magazine.
Fuhan Liu,
Chandrasekharan Nair,
Rao R. Tummala,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Madhavan Swaminathan,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Y. Joshi,
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2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Madhavan Swaminathan,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Satomi Kawamoto,
Vanessa Smet,
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
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IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Madhavan Swaminathan,
Venky Sundaram,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Fuhan Liu,
R. Tummala,
M. Swaminathan,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
George E. White,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
R. Tummala,
M. Kathaperumal,
M. Losego,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Bartlet DeProspo,
Chandrasekharan Nair,
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Yuya Suzuki,
2017
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R. Tummala,
S. Sitaraman,
P. Raj,
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Pulugurtha Markondeya Raj,
Manos M. Tentzeris,
Rao R. Tummala,
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IEEE Transactions on Components, Packaging and Manufacturing Technology.
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V. Sundaram,
R. Tummala,
J. Papapolymerou,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
A. Peterson,
V. Sundaram,
R. Tummala,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Wenjing Su,
Zihan Wu,
Yunnan Fang,
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2017 IEEE MTT-S International Microwave Symposium (IMS).
C. P. Wong,
H. Reichl,
Jianmin Qu,
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2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
R. Tummala,
Junyong Park,
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IEEE Transactions on Electromagnetic Compatibility.
R. Tummala,
V. Smet,
V. Sundaram,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
R. Tummala,
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Journal of Microelectronics and Electronic Packaging.
Xi Liu,
Qiao Chen,
Suresh K. Sitaraman,
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Rao R. Tummala,
R. Tummala,
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2017 IEEE International Electron Devices Meeting (IEDM).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
R. Tummala,
1975
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Ryan Bahr,
Rao Tummala,
Venky Sundaram,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Manos M. Tentzeris,
Venky Sundaram,
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2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO).
R. Tummala,
B. Foster,
1975
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Rao Tummala,
R. Tummala,
1976
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Joungho Kim,
Venky Sundaram,
Jonghyun Cho,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
R. Tummala,
1990
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R. Tummala,
Minsuk Kim,
P. Raj,
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Journal of Materials Science: Materials in Electronics.
Rao Tummala,
Swapan K. Bhattacharya,
Gopal C. Jha,
2008
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Linghua Kong,
Fuhan Liu,
Fengtao Wang,
2010,
IEEE Transactions on Advanced Packaging.
Collen Z. Leng,
V. Sundaram,
R. Tummala,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Rao R. Tummala,
Hirokazu Ito,
R. Tummala,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
V. Sundaram,
R. Tummala,
K. Demir,
2017,
IEEE Transactions on Device and Materials Reliability.
V. Sundaram,
R. Tummala,
K. Demir,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Tentzeris,
M. Pulugurtha,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Himani Sharma,
Markondeya Raj Pulugurtha,
Rao R. Tummala,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
R. Tummala,
Hao Lu,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fuhan Liu,
R. Tummala,
M. Swaminathan,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Himani Sharma,
P. M. Raj,
Rao R. Tummala,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
R. Tummala,
P. Chakraborti,
P. Raj,
2013
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V. Sundaram,
R. Tummala,
P. Raj,
2011,
2011 11th IEEE International Conference on Nanotechnology.
V. Sundaram,
R. Tummala,
P. Raj,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Suresh K. Sitaraman,
Rao R. Tummala,
Venkatesh Sundaram,
2014,
IEEE Transactions on Device and Materials Reliability.