M. Heikkinen

Hybrid In-Mould Integration

Janne Aikio, Tuomo Jaakola, Arttu Huttunen, 2013 .

Adhesion of Flexible Printed Circuit Substrate to Overmoulded Polymer and Characterization of Overmoulded Electronic Components

T. Alajoki, M. Koponen, M. Heikkinen, 2008 .

Laser profilometer module based on a low- temperature cofired ceramic substrate

M. Heikkinen, K. Keränen, V. Heikkinen, 2005 .

Thermal management of fully LTCC-packaged Cs vapour cell for MEMS atomic clock

Christophe Gorecki, Nicolas Passilly, Aila Sitomaniemi, 2012 .

Injection Molded Structural Electronics Brings Surfaces to Life

Tomi Simula, Paavo Niskala, Outi Rusanen, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Hybrid in-mould integration for novel electrical and optical features in 3D plastic products

Teemu Alajoki, Mikko Heikkinen, Markus Tuomikoski, 2012, 2012 4th Electronic System-Integration Technology Conference.

Thermal analysis of LTCC packaged MEMS atomic clock

K. Kautio, M. Heikkinen, C. Gorecki, 2012, 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.

In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components

J. Ollila, M. Heikkinen, J. Petaja, 2009, 2009 European Microelectronics and Packaging Conference.