Yi Li

Yi Li, C. Wong, S. Pothukuchi, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Shape controlled synthesis of nanoparticles and their incorporation into polymers

Yi Li, C. Wong, S. Pothukuchi, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Processing and shape effects on silver paste electrically conductive adhesives (ECAs)

Yi Li, Cho-Liang Chung, Yi Li, 2005 .

Lead-free interconnect technique by using variable frequency microwave

Yi Li, K. Moon, C. Wong, 2005 .

Non-Conductive Adhesives/Films (NCA/NCF)

Yi Li, D. Lu, C. Wong, 2010 .

A novel non-migration nano-Ag conductive adhesive with enhanced electrical and thermal properties via self-assembled monolayers modification

Yi Li, C. Wong, 2006, 56th Electronic Components and Technology Conference 2006.

Silver migration control in electrically conductive adhesives

Yi Li, C. Wong, 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..

High Performance Conductive Adhesives for Lead-Free Interconnects

Yi Li, C. Wong, 2006 .

Enhancing the electrical and optoelectronic performance of nanobelt devices by molecular surface functionalization.

Yi Li, C. Lao, C. Wong, 2007, Nano letters.

Nano-bio-electronic , photonic and MEMS packaging

Ching-Ping Wong, Kyoung-Sik Moon, Yi Li, 2010 .

Electronics Without Lead

Yi Li, Ching-Ping Wong, Kyoung-Sik Moon, 2005, Science.

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Ching-Ping Wong, Andrew Hunt, Yi Li, 2005 .

Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives

Yi Li, Kyoung-Sik Moon, Myung Jin Yim, 2007 .

Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites

Ching-Ping Wong, Yi Li, Hongjin Jiang, 2006 .

Films, Coatings, Adhesives, Polymers, and Thermoelectric Materials

Yi Li, K. Moon, A. Maignan, 2008 .

Novel curing agent for lead‐free electronics: Amino acid

Ching-Ping Wong, Kyoung-Sik Moon, Yi Li, 2006 .

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Yi Li, Ching-Ping Wong, Kyung-Wook Paik, 2008 .

Materials science. Electronics without lead.

Yi Li, K. Moon, C. Wong, 2005, Science.

First-principles calculations of stability of graphene-like BC3 monolayer and its high-performance potassium storage

Yi Li, Jiajun Wang, Shulai Lei, 2020 .

Novel lead free nanoscale nonconductive adhesive (NCA) for ultra-fine pitch interconnect applications

Yi Li, K. Moon, C. Wong, 2006, 56th Electronic Components and Technology Conference 2006.

Development of isotropic conductive adhesives with improved conductivity

Yi Li, K. Moon, C. Wong, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Monolayer protection for eletrochemical migration control in silver nanocomposite

Yi Li, Ching-Ping Wong, Yi Li, 2006 .

Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids

Yi Li, K. Moon, C. Wong, 2006, IEEE Transactions on Components and Packaging Technologies.

NANO materials and composites for electronic and photo packaging

Yi Li, C.P. Wong, Hongjin Jiang, 2009, 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO).

Development of a novel polymer–metal nanocomposite obtained through the route of in situ reduction for integral capacitor application

Yi Li, C. Wong, S. Pothukuchi, 2004 .

Lead-free solder interconnect by variable frequency microwave (VFM)

Yi Li, K. Moon, C. Wong, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

High performance anisotropic conductive adhesives for lead‐free interconnects

Yi Li, C. Wong, 2006 .

Electrical Conductive Adhesives with Nanotechnologies

Daniel Lu, Ching-Ping Wong, Yi Li, 2010 .

Ultra high conductivity of isotropic conductive adhesives

Yi Li, C.P. Wong, Hongjin Jiang, 2006, 56th Electronic Components and Technology Conference 2006.

Characterizations of Electrically Conductive Adhesives

Yi Li, D. Lu, C. Wong, 2010 .

Nano-conductive Adhesives for Nano-electronics Interconnection

Yi Li, 2020 .

Nano-conductive Adhesives for Nano-electronics Interconnection

Yi Li, 2020 .

Nano-conductive Adhesives for Nano-electronics Interconnection

Yi Li, 2020 .

High Performance Nonconductive Film with π-Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications

Yi Li, C. Wong, M. Yim, 2007 .

Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules

Yi Li, M. Yim, H. Dong, 2007 .

Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes

Yi Li, C.P. Wong, Kyoung-Sik Moon, 2006, IEEE Transactions on Components and Packaging Technologies.

Reliability improvement of conductive adhesives on tin (Sn) surfaces

Yi Li, K. Moon, C. Wong, 2005 .

Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection

Yi Li, K. Moon, C. Wong, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

High performance conductive adhesives modified with molecular wires

Yi Li, C. Wong, 2005, 2005 7th Electronic Packaging Technology Conference.

Improvement of electrical performance of anisotropically conductive adhesives

Yi Li, K. Moon, C. Wong, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

High Performance Anistropic Conductive Adhesives for Lead-free Interconnects

Yi Li, C. Wong, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

Recent advances on electrical conductive adhesives (ECAs)

Yi Li, C. Wong, 2004, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004..

Electrical property of anisotropically conductive adhesive joints modified by self-assembled monolayer (SAM)

Yi Li, C.P. Wong, Kyoung-sik Moon, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Effects of Reducing Agents on the Electrical Properties of Electrically Conductive Adhesives

Yi Li, K. Moon, C. Wong, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

Conductivity improvement of isotropic conductive adhesives with short-chain dicarboxylic acids

Yi Li, K. Moon, C. Wong, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

A novel technique for lead-free soldering process using variable frequency microwave (VFM)

Yi Li, K. Moon, C. Wong, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

High performance electrically conductive adhesives (ECAs) modified with novel aldehydes

Yi Li, C.P. Wong, Kyoung-sik Moon, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Yi Li, K. Moon, C. Wong, 2010 .

Nano materials for microelectronic and photonic packaging

Yi Li, K. Moon, Wei Lin, 2008, PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics.

Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications

Yi Li, K. Moon, C. Wong, 2008, 2008 58th Electronic Components and Technology Conference.

High Performance Nano-scale Conductive Films with Low Temperature Sintering for Fine Pitch Electronic Interconnect

Yi Li, C. Wong, M. Yim, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

Nano-Scale Conductive Films with Low Temperature Sintering for High Performance Fine Pitch Interconnect

Yi Li, C.P. Wong, Myung Jin Yim, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Novel Monolayer-enhanced Non-Conductive Film (NCF) for Ultra-Fine Pitch High Performance Interconnect in Lead-free Electronics

Yi Li, C. Wong, M. Yim, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Nano-scale Conductive Films for High Performance Fine Pitch Interconnect

Yi Li, K. Moon, M. Yim, 2007 .