C. Wong

发表

Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications

Yi Li, K. Moon, C. Wong, 2006, Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006..

Assembling of carbon nanotube structures by chemical anchoring for packaging applications

K. Moon, C. Wong, Wei Lin, 2008, 2008 58th Electronic Components and Technology Conference.

Rational Design of a Printable, Highly Conductive Silicone‐based Electrically Conductive Adhesive for Stretchable Radio‐Frequency Antennas

K. Moon, C. Wong, M. Tentzeris, 2015 .

A novel “green” fully-integrated ultrasensitive RFID-enabled gas sensor utilizing inkjet-printed antennas and carbon nanotubes

C. Wong, M. Tentzeris, L. Yang, 2009, 2009 IEEE Antennas and Propagation Society International Symposium.

Wafer bonding using microwave heating of parylene for MEMS packaging

K. Moon, C. Wong, P. Hesketh, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

High-k Polymer Nanocomposites as Gate Dielectrics for Organic Electronics Applications

K. Moon, C. Wong, Jiongxin Lu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Epoxy Composites with Surface Modified Silicon Carbide Filler for High Temperature Molding Compounds

K. Moon, C. Wong, B. Song, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Magnetic nanocomposite for high Q embedded inductor

Fuhan Liu, C.P. Wong, Fuhan Liu, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Effect of Ferritic Density and Zinc on Magnetic Properties of Cobalt Ferrite Nanocomposites

K. Moon, C. Wong, H. Dong, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

A Novel Conformal RFID-Enabled Module Utilizing Inkjet-Printed Antennas and Carbon Nanotubes for Gas-Detection Applications

Li Yang, D. Staiculescu, C.P. Wong, 2009, IEEE Antennas and Wireless Propagation Letters.

A Novel Nanocomposite With Photo-Polymerization for Wafer Level Application

C. Wong, Lingbo Zhu, Hongjin Jiang, 2008, IEEE Transactions on Components and Packaging Technologies.

Correlation of flip chip underfill process parameters and material properties with in-process stress generation

P. J. Selman, C. Wong, D. Baldwin, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

A Combined Process of In Situ Functionalization and Microwave Treatment to Achieve Ultrasmall Thermal Expansion of Aligned Carbon Nanotube–Polymer Nanocomposites: Toward Applications as Thermal Interface Materials

K. Moon, C. Wong, Wei Lin, 2009 .

A novel environmentally friendly and biocompatible curing agent for lead-free electronics

Yi Li, K. Moon, C. Wong, 2006, 56th Electronic Components and Technology Conference 2006.

Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill

R. Tummala, C. Wong, M. Iyer, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Dielectric behavior of ultrahigh-k carbon black composites for embedded capacitor applications

C. Wong, Jianwen Xu, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Chemical Transfer of in-situ Functionalized Aligned Carbon Nanotube Structures for Microelectronic Packaging Applications

K. Moon, C. Wong, Wei Lin, 2008, 2008 10th Electronics Packaging Technology Conference.

Novel All Organic High Dielectric Constant Polyaniline/epoxy Composites for Embedded Capacitor Applications

K. Moon, C. Wong, Jiongxin Lu, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

Microstructured and Plasma Etched PDMS Materials as Hydrophobic Materials

C. Wong, Jianwen Xu, B. Englert, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

Polymer nanocomposites with high dielectric strength and high frequency performance for emdedded passive applications

C. Wong, Jiongxin Lu, 2008, PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics.

Tailored Dielectric Properties of High-k Polymer Composites via Nanoparticle Surface Modification for Embedded Passives Applications

C. Wong, Jiongxin Lu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Comprehensive Study on the Impact of Dielectric and Magnetic Loss on Performance of a Novel Flexible Magnetic Composite Material

C. Wong, M. Tentzeris, Li Yang, 2008, 2008 38th European Microwave Conference.

Optimizing geometrical design of superhydrophobic surfaces for prevention of microelectromechanical system (MEMS) stiction

C. Wong, Y. Xiu, Lingbo Zhu, 2006, 56th Electronic Components and Technology Conference 2006.

Recent Advances on Polymers and Polymer Nanocomposites for Advanced Electronic Packaging Applications

C. Wong, Y. Sun, H. Jiang, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

Influence of thermal treatment on the conductivity of PEDT films

C. Wong, Jun Li, L. Fan, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Four-laser bending beam measurements and FEM modeling of underfill induced wafer warpage

C. Wong, S. Sitaraman, Zhuqing Zhang, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Room temperature stable underfill with novel latent catalyst for wafer level flip-chip packaging applications

C. Wong, Yangyang Sun, 2006, 56th Electronic Components and Technology Conference 2006.

Investigation on effect of carbon black and polymer matrix on conductive polymer composites with positive temperature coefficient

C. Wong, S. Luo, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Dielectric performance enhancement of nanoparticle-based materials for embedded passive applications

C. Wong, Jiongxin Lu, 2008, 2008 58th Electronic Components and Technology Conference.

Influence of temperature and humidity on adhesion of underfills for flip chip packaging

C. Wong, S. Luo, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Environmental influence on adhesion of underfill with passivation materials

C. Wong, S. Luo, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Study on influence of environment on adhesion performance of underfill for flip chip application

C. Wong, S. Luo, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $\pi$ -Conjugated Self-Assembled Molecular Wire Junctions

Yi Li, K. Moon, C. Wong, 2009, IEEE Transactions on Components and Packaging Technologies.

Incorporation of π-conjugated Molecular Wires into Anisotropic Conductive Adhesive for High-performance Interconnection Applications

K. Moon, C. Wong, Wei Lin, 2008, 2008 10th Electronics Packaging Technology Conference.

Electrically conductive adhesive with π-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties

Yi Li, K. Moon, C. Wong, 2008, 2008 58th Electronic Components and Technology Conference.

Formulation of different shapes of nanoparticles and their incorporation into polymers

Yi Li, C. Wong, S. Pothukuchi, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Shape controlled synthesis of nanoparticles and their incorporation into polymers

Yi Li, C. Wong, S. Pothukuchi, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Stretchable, Printable and Electrically Conductive Composites for Wearable RF Antennas

K. Moon, C. Wong, M. Tentzeris, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

A Novel Method to Prepare Superhydrophobic, Self-Cleaning and Transparent Coatings for Biomedical Applications

C. Wong, Y. Xiu, D. Hess, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

K. Moon, C. Wong, Hongjin Jiang, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Evaluation of the environmental protection of photo BCB polymers (Cyclotene/sup TM/ 4000)

C. Wong, P. Garrou, W. B. Rogers, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Study on rate-dependent behaviors of underfills based on two-phase composites

C. Wong, Sheng Liu, Z. Qian, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

A novel aluminum-filled composite dielectric for embedded passive applications

K. Moon, C. Wong, Jianwen Xu, 2006, IEEE Transactions on Advanced Packaging.

Development of transparent and flexible electrically conductive adhesives for microelectronics applications

K. Moon, C. Wong, Wei Lin, 2008, PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics.

A novel non-migration nano-Ag conductive adhesive with enhanced electrical and thermal properties via self-assembled monolayers modification

Yi Li, C. Wong, 2006, 56th Electronic Components and Technology Conference 2006.

Silver migration control in electrically conductive adhesives

Yi Li, C. Wong, 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..

Effects of the low loss polymers on the dielectric behavior of novel aluminum-filled high-k nano-composites

C. Wong, Jianwen Xu, Ching-ping Wong, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Adhesion improvement of thermoplastic conductive adhesives under humid environment

K. Moon, C. Wong, W. Burgoyne, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Giant Permittivity in Polyvinylidene Fluoride Composites Filled with Flower-Like BaTiO3 for Energy Storage

C. Wong, Gang Jian, Yong Jiao, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

In-situ Photochemical Synthesis of Novel Silver Nanoparticles-Polymer Composites as High K Polymer Matrix for Embedded Passives Applications

K. Moon, C. Wong, Jiongxin Lu, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

Development of novel silver nanoparticles/polymer composites as high K polymer matrix by in-situ photochemical method

K. Moon, C. Wong, Jiongxin Lu, 2006, 56th Electronic Components and Technology Conference 2006.

RICH detectors development for hadron identification at EIC: design, prototyping and reconstruction algorithm

C. Wong, C. Fanelli, E. Cisbani, 2020, Journal of Instrumentation.

Self-assembled monolayer-assisted chemical transfer of in situ functionalized carbon nanotubes.

K. Moon, C. Wong, Wei Lin, 2008, Journal of the American Chemical Society.

A reworkable epoxy resin for isotropically conductive adhesive

C. Wong, Haiying Li, 2004, IEEE Transactions on Advanced Packaging.

Large-area processable high K nanocomposite-based embedded capacitors

K. Moon, C. Wong, S. Bhattacharya, 2006, 56th Electronic Components and Technology Conference 2006.

Electronics Without Lead

Yi Li, Ching-Ping Wong, Kyoung-Sik Moon, 2005, Science.

Material characterization of high dielectric constant polymer-ceramic composite for embedded capacitor to RF application

Yang Rao, C.P. Wong, C. Wong, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Wafer level batch packaging (WLBP): incorporation of air pores/foams in a polyimide matrix using a low modulus sacrificial commercial polymer

C. Wong, C. Wong, J. Williamson, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Study and characterizations on the post cure behavior of underfill

C. Wong, Zhuqing Zhang, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Highly Conductive, Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics

K. Moon, C. Wong, Yan Liu, 2013 .

Design of Miura Folding-Based Micro-Supercapacitors as Foldable and Miniaturized Energy Storage Devices

K. Moon, C. Wong, B. Song, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Development of high performance photo-curable nanocomposites for electronics packaging

C. Wong, Zhuqing Zhang, Yangyang Sun, 2005, 2005 7th Electronic Packaging Technology Conference.

Photo-Definable Nanocomposite for Wafer Level Packaging

C. Wong, Zhuqing Zhang, Yangyang Sun, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Novel lead free nanoscale nonconductive adhesive (NCA) for ultra-fine pitch interconnect applications

Yi Li, K. Moon, C. Wong, 2006, 56th Electronic Components and Technology Conference 2006.

Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications

C.P. Wong, Hongjin Jiang, Kyoung-sik Moon, 2008, 2008 58th Electronic Components and Technology Conference.

Moisture absorption in uncured underfill materials

C. Wong, S. Luo, 2004, IEEE Transactions on Components and Packaging Technologies.

Electrical and mechanical modeling of embedded capacitors

Yang Rao, Jianmin Qu, C. Wong, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill

C. Wong, D. Baldwin, M. Yim, 2009, IEEE Transactions on Electronics Packaging Manufacturing.

Assembling Carbon Nanotube Bundles Using Transfer Process for Fine-Pitch Electrical Interconnect Applications

C.P. Wong, Lingbo Zhu, Kyoung-Sik Moon, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

In-situ Opening Aligned Carbon Nanotubes and Applications for Device Assembly and Field Emission

C.P. Wong, C. Wong, D. Hess, 2006, 2006 Optics Valley of China International Symposium on Optoelectronics.

Controlled Growth of Well-Aligned Carbon Nanotubes and Their Assembly

C. Wong, Y. Xiu, Lingbo Zhu, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

In-situ opening aligned carbon nanotube films/arrays for multichannel ballistic transport in electrical interconnect

C.P. Wong, Lingbo Zhu, C. Wong, 2006, 56th Electronic Components and Technology Conference 2006.

Growth of aligned carbon nanotube arrays for electrical interconnect

C.P. Wong, Lingbo Zhu, C. Wong, 2005, 2005 7th Electronic Packaging Technology Conference.

Aligned carbon nanotubes for electrical interconnect and thermal management

C.P. Wong, Yangyang Sun, Lingbo Zhu, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Creep behavior characterization of some new materials for high density interconnect substrates using dynamic mechanical analyzer (DMA)

Yang Rao, Jianmin Qu, Ching-Ping Wong, 1998, Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).

Recent advances in underfill technology for flip-chip, ball grid array, and chip scale package applications

C. P. Wong, Lejun Wang, C. Wong, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Effects of nano-sized particles on electrical and thermal conductivities of polymer composites

Jianmin Qu, C.P. Wong, Lianhua Fan, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Development of isotropic conductive adhesives with improved conductivity

Yi Li, K. Moon, C. Wong, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Mixed filler combinations for enhanced thermal conductivity of liquid encapsulants for electronic packaging

C.P. Wong, C. Wong, R. S. Bollampally, 1998, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Recent advances in flip-chip underfill: materials, process, and reliability

C.P. Wong, C. Wong, Zhuqing Zhang, 2004, IEEE Transactions on Advanced Packaging.

Super high dielectric constant carbon black-filled polymer composites as integral capacitor dielectrics

C. Wong, Jianwen Xu, M. Wong, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Dielectric properties of polymer composite as integral capacitor

K. Moon, C. Wong, Jianwen Xu, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Ultra high dielectric constant epoxy silver composite for embedded capacitor application

Yang Rao, C. Wong, C. P. Wong, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Conformal Magnetic Composite RFID for Wearable RF and Bio-Monitoring Applications

D. Staiculescu, L. Yang, C.P. Wong, 2008, IEEE Transactions on Microwave Theory and Techniques.

Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization

C. Wong, A. Chan, K. Pun, 2018, Journal of Materials Science: Materials in Electronics.

Properties of some rodlike polymers in solution

C. Wong, H. Ohnuma, G. Berry, 2007 .

Preparation of Superhydrophobic Silica Thin Films for Antistiction of MEMS Devices Using a Novel Sol-Gel Process

C. Wong, Y. Xiu, Lingbo Zhu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Preencapsulation cleaning methods and control for microelectronics packaging

C.P. Wong, R. McBride, C. Wong, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Ching-Ping Wong, Andrew Hunt, Yi Li, 2005 .

Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging

K. Moon, C. Wong, Ching-ping Wong, 2007 .

Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications

D. Staiculescu, C.P. Wong, L.J. Martin, 2009, IEEE Transactions on Components and Packaging Technologies.

Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids

Yi Li, K. Moon, C. Wong, 2006, IEEE Transactions on Components and Packaging Technologies.

Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability

C. Wong, S. Shi, D. Lu, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Characterization of a no-flow underfill encapsulant during the solder reflow process

C. Wong, B. Fennell, D. Baldwin, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

C. Wong, S. Shi, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Development of new no-flow underfill materials for both eutectic solder and a high temperature melting lead-free solder

C. Wong, Haiying Li, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

No-flow underfill formulation using different epoxy resin combination

W. Reed, C. Wong, L. Fan, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

A new approach in the development of no-flow underfill materials for both eutectic and lead-free solders with high melting temperature

C. Wong, C. Wong, Haiying Li, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Development of no-flow underfill for lead-free bumped flip-chip assemblies

C. Wong, Zhuqing Zhang, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

Incorporation of inorganic filler into the no-flow underfill material for flip-chip application

Songhua Shi, Lianhua Fan, C. Wong, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Study on the correlation of flip-chip reliability with mechanical properties of no-flow underfill materials

Jianmin Qu, Qizhou Yao, C. Wong, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Development of no-flow underfill materials for lead-free solder bumped flip-chip applications

C. Wong, S. Shi, Z.Q. Zhang, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Reworkable no-flow underfills for flip chip applications

Ching-Ping Wong, C. Wong, H. Li, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application

C. Wong, C. P. Wong, S. H. Shi, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Development of the wafer level compressive-flow underfill process and its required materials

C. Wong, S. Shi, T. Yamashita, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Development and characterization of imidazole derivative cured bisphenol A epoxy materials for flip-chip underfill applications

C. Wong, S. Shi, T. Yamashita, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Development of the wafer level compressive-flow underfill encapsulant

C. Wong, T. Yamashita, S. Shi, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

High performance underfills development - materials, processes, and reliability

C. Wong, L. Hoang, L. Nguyen, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).

High performance no flow underfills for low-cost flip-chip applications

Ching-Ping Wong, C. Wong, S. H. Shi, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Optimization of Epoxy-Barium Titanate Nanocomposites for High Performance Embedded Capacitor Components

K. Moon, C. Wong, S. Bhattacharya, 2007, IEEE Transactions on Components and Packaging Technologies.

Study and characterization on the nanocomposite underfill for flip chip applications

C. Wong, Zhuqing Zhang, Yangyang Sun, 2006, IEEE Transactions on Components and Packaging Technologies.

Effective dielectric constant prediction of polymer-ceramic composite based on self-consistent theory

C. Wong, J. Qu, T. Marinis, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Variable Frequency Microwave Synthesis of Silver Nanoparticles

K. Moon, C. Wong, Zhuqing Zhang, 2006 .

NANO materials and composites for electronic and photo packaging

Yi Li, C.P. Wong, Hongjin Jiang, 2009, 2009 9th IEEE Conference on Nanotechnology (IEEE-NANO).

Lead-free solder interconnect by variable frequency microwave (VFM)

Yi Li, K. Moon, C. Wong, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Fundamental study of electrically conductive adhesives (ECAs)

C. Wong, C. P. Wong, D. Lu, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).

Novel Nonconductive Adhesives/Films With Carbon Nanotubes for High-Performance Interconnects

C. Wong, Wei Lin, Hongjin Jiang, 2008, IEEE Transactions on Components and Packaging Technologies.

Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects

K. Moon, C. Wong, Hongjin Jiang, 2009, 2008 58th Electronic Components and Technology Conference.

Rheological studies on concentrated solutions of heterocyclic polymers

C. Wong, G. Berry, 1979 .

Study on surface tension and adhesion in electronic packaging

C. Wong, S. Luo, M. Vidal, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Improvement of epoxy adhesion to polyimide passivation

C. Wong, S. Luo, 2002, Electronic Components and Technology Conference.

Fundamental adhesion issues for advanced flip chip packaging

Shijian Luo, Quinn K. Tong, A. Savoca, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Experimental investigation of time dependent degradation of coupling agent bonded interfaces

C. Wong, D. Lam, C. Wong, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Influence of chemistry and applied stress on reliability of polymer and substrate interfaces

C. Wong, D. Lam, S. Leung, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Silver Surface Iodination for Enhancing the Conductivity of Conductive Composites

Matthew Ming Fai Yuen, Cheng Yang, Ching-Ping Wong, 2010 .

Lotus effect surface for prevention of microelectromechanical system (MEMS) stiction

C.P. Wong, Lingbo Zhu, C. Wong, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

High dielectric constant polymer-ceramic composite for embedded capacitor application

C. Wong, Ching-ping Wong, P. Kohl, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Novel reworkable fluxing underfill for board level assembly

C. Wong, Zhuqing Zhang, Haiying Li, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Stretchable and Electrically Conductive Composites Fabricated from Polyurethane and Silver Nano/Microstructures

K. Moon, C. Wong, B. Song, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Characterization of Silver Flake Lubricants

C. Wong, D. Lu, C. Wong, 2000 .

Investigation of a Biocompatible Polyurethane-Based Isotropically Conductive Adhesive for UHF RFID Tag Antennas

C. Wong, M. Yuen, Bo Gao, 2011 .

Ultra high conductivity of isotropic conductive adhesives

Yi Li, C.P. Wong, Hongjin Jiang, 2006, 56th Electronic Components and Technology Conference 2006.

Use of dendirimers to control nanoparticle size in polymer-metal nanocomposites for embedded capacitor application

C. Wong, C. Wong, S. Pothukuchi, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Superhydrophobic Silica Thin Films Prepare by Sol-Gel Process for Antistiction of MEMS Devices

C. Wong, Y. Xiu, Lingbo Zhu, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

Superhydrophobicity and UV stability of polydimethylsiloxane/polytetrafluoroethylene (PDMS/PTFE) coatings

C. Wong, Y. Xiu, Lingbo Zhu, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

Superhydrophobic silicone/PTFE films for biocompatible application in encapsulation of implantable microelectronics devices

C. Wong, Y. Xiu, Lingbo Zhu, 2006, 56th Electronic Components and Technology Conference 2006.

Reliability of Nano-Structured Nickel Interconnections Replacing FlipChip Solder Assembly without Underfill

C.P. Wong, M. Swaminathan, P. Markondeya Raj, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Nano-Ag Filled Anisotropic Conductive Adhesives (ACA) with Self-Assembled Monolayer and Sintering Behavior for High

C. Wong, G. Yi Li, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Thermal properties of oxide free nano non noble metal for low temperature interconnect technology

F. Hua, K. Moon, C. Wong, 2006, 56th Electronic Components and Technology Conference 2006.

A rapid growth of aligned carbon nanotube films and high-aspect-ratio arrays

C. Wong, Y. Xiu, Lingbo Zhu, 2006 .

Novel high performance no flow and reworkable underfills for flip-chip applications

C. Wong, S. Shi, Lejun Wang, 1999 .

Enhancement of underfill performance for flip-chip applications by use of silane additives

C. Wong, M. Vincent, L. Meyers, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Enhancement of fast-flow underfill performance by use of silane additives

C. Wong, M. Vincent, 1998, Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).

Silver dendrites based electrically conductive composites, towards the application of stretchable conductors

C. Wong, R. Sun, C. Wong, 2020 .

Carbon Nanotube/Polymer Nanocomposites: Improved or Reduced Thermal Stabilities?

K. Moon, C. Wong, Zhuo Li, 2012 .

Deconstructing the myth of percolation in electrically conductive adhesives and its implications

K. Moon, C. Wong, J. Agar, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes

Yi Li, C.P. Wong, Kyoung-Sik Moon, 2006, IEEE Transactions on Components and Packaging Technologies.

Adhesion improvement of thermoplastic isotropically conductive adhesive

C. Wong, W. Burgoyne, S. Liong, 2005, IEEE Transactions on Components and Packaging Technologies.

A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces

K. Moon, C. Wong, Haiying Li, 2004 .

Mechanisms underlying the unstable contact resistance of conductive adhesives

C.P. Wong, Daoqiang Lu, C. Wong, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Novel conductive adhesives for surface mount applications

C. Wong, D. Lu, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Conductivity mechanisms of isotropic conductive adhesives (ICAs)

Daoqiang Lu, C. Wong, C. P. Wong, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection

Yi Li, K. Moon, C. Wong, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

High performance conductive adhesives modified with molecular wires

Yi Li, C. Wong, 2005, Electronic Packaging Technology Conference.

Improvement of electrical performance of anisotropically conductive adhesives

Yi Li, K. Moon, C. Wong, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Overview of recent advances on isotropic conductive adhesives

C. Wong, D. Lu, 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..

High Performance Anistropic Conductive Adhesives for Lead-free Interconnects

Yi Li, C. Wong, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

Recent advances on electrical conductive adhesives (ECAs)

Yi Li, C. Wong, 2004, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004..

Electrical property of anisotropically conductive adhesive joints modified by self-assembled monolayer (SAM)

Yi Li, C.P. Wong, Kyoung-sik Moon, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

The depletion/wetting of the low melting point alloy in electrically conductive adhesives (ECAs)

K. Moon, C. Wong, Jiali Wu, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Development of solder replacement isotropic conductive adhesives

C. Wong, Ching-ping Wong, D. Lu, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Recent advances in electrically conductive adhesives for electronics applications

Daoqiang Lu, C. Wong, C. P. Wong, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Effects of Reducing Agents on the Electrical Properties of Electrically Conductive Adhesives

Yi Li, K. Moon, C. Wong, 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

Molecular dynamics simulation of lead free solder for low temperature reflow applications

C.P. Wong, Kyoung-sik Moon, Lianhua Fan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Surface treatment of MWCNT array and its polymer composites for TIM application

K. Moon, C. Wong, Wei Lin, 2008, 2008 58th Electronic Components and Technology Conference.

Design and development of compact conformal RFID antennas utilizing novel flexible magnetic composite materials for wearable RF and biomedical applications

D. Staiculescu, L. Yang, L. Martin, 2008, 2008 IEEE Antennas and Propagation Society International Symposium.

Investigation of the Impact of Magnetic Permeability and Loss of Magnetic Composite Materials on RFID and RF Passives Miniaturization

D. Staiculescu, L. Martin, C.P. Wong, 2007, 2007 Workshop on Computational Electromagnetics in Time-Domain.

Investigation of the impact of magnetic permeability and loss of magnetic composite materials on RFID miniaturization for conformal medical applications

C. Wong, M. Tentzeris, D. Staiculescu, 2009 .

Formation and stability of magnetron sputtered Al-TM-RE metallic glasses

C. Wong, L. Kabacoff, S. Dallek, 1991 .

Nano materials for microelectronic packaging

C. Wong, W. Lin, R. Zhang, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect

C.P. Wong, C. Wong, Myung Jin Yim, 2009, IEEE Transactions on Advanced Packaging.

Conductivity improvement of isotropic conductive adhesives with short-chain dicarboxylic acids

Yi Li, K. Moon, C. Wong, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

A novel technique for lead-free soldering process using variable frequency microwave (VFM)

Yi Li, K. Moon, C. Wong, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

High performance electrically conductive adhesives (ECAs) modified with novel aldehydes

Yi Li, C.P. Wong, Kyoung-sik Moon, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Study on metal adhesion mechanisms in high density interconnect printed circuit boards

C. Wong, L. Martin, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Modeling of the curing kinetics of no-flow underfill in flip-chip applications

C. Wong, Zhuqing Zhang, 2004, IEEE Transactions on Components and Packaging Technologies.

Effect of sacrificial anodic fillers on contact resistance stability of electrically conductive adhesives onto lead-free alloy surfaces

K. Moon, C. Wong, Haiying Li, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Formulation and Processing of Conductive Polysulfide Sealants for Automotive and Aerospace Applications

K. Moon, C. Wong, B. Song, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Lotus Effect coating and its application for microelectromechanical systems stiction prevention

C. Wong, Jun Li, Jianwen Xu, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Numerical and experimental investigations of large IC flip chip attach

C. P. Wong, H. Reichl, Jianmin Qu, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Influence of temperature and humidity on adhesion of underfills for flip chip packaging

C.P. Wong, C. Wong, S. Luo, 2005, IEEE Transactions on Components and Packaging Technologies.

Studies of latent catalyst systems for pot-life enhancement of underfills

C. Wong, Lejun Wang, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Fabrication and Characterization of ZnO Nanorod Arrays Grown on Nickel-Coated Polyester Fiber

C. Wong, C. Mak, 2012 .

Study on mobility of water and polymer chain in epoxy for microelectronic applications

C. Wong, J. Leisen, S. Luo, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

A novel approach for incorporating silica filler into no-flow underfill

C. Wong, Zhuqing Zhang, Jicun Lu, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Void Formation Study of Flip Chip in Package Using No-Flow Underfill

C.P. Wong, S. Lee, C. Wong, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Effects of the low loss polymers on the dielectric behavior of novel aluminum-filled high-k nano-composites [embedded capacitor applications]

C. Wong, Jianwen Xu, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Development of a novel aluminum-filled composite for embedded passive applications

C. Wong, C. Wong, Jianwen Xu, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications

Yi Li, K. Moon, C. Wong, 2008, 2008 58th Electronic Components and Technology Conference.

High performance non-conductive film (NCF) with conjugated molecular wires

C. Wong, Myung Jin Yim, Yi Li, 2007, 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces.

High Performance Nano-scale Conductive Films with Low Temperature Sintering for Fine Pitch Electronic Interconnect

Yi Li, C. Wong, M. Yim, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

Nano-Scale Conductive Films with Low Temperature Sintering for High Performance Fine Pitch Interconnect

Yi Li, C.P. Wong, Myung Jin Yim, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Novel Monolayer-enhanced Non-Conductive Film (NCF) for Ultra-Fine Pitch High Performance Interconnect in Lead-free Electronics

Yi Li, C. Wong, M. Yim, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Adhesion enhancement of underfill materials by silane additives

C. Wong, J. Qu, C. Wong, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes

Yi Li, K. Moon, C. Wong, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Stabilizing contact resistance of conductive adhesives on Sn surface by novel corrosion inhibitors

Yi Li, K. Moon, C. Wong, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Development of solder replacement conductive adhesives with stable resistance and superior impact performance

C. Wong, D. Lu, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Development of high performance surface mount conductive adhesives

C. Wong, D. Lu, E. Zhang, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Conductive adhesives for solder replacement in electronics packaging

C. Wong, D. Lu, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Adhesion performance and thermo-mechanical property of epoxy-based underfill

C. Wong, C. Wong, S. Luo, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Adhesion comparison between thermosetting and thermoplastic resin systems based on poly(bisphenol A-co-epichlorohydrin) chemistry

C. Wong, L. Fan, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Cyanate Ester/Epoxy Co-Curing System with Thermal Stabilizers for High Temperature Stability

K. Moon, C. Wong, B. Song, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Thermosetting and thermoplastic bisphenol A epoxy/phenoxy resin as encapsulant material

C. Wong, L. Fan, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly

J. Fulton, C. Wong, D. D. Chang, 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).