L. Madden

A 200 MHz 64 b dual-issue CMOS microprocessor

Burton M. Leary, S. Santhanam, D. Dobberpuhl, 1992, 1992 IEEE International Solid-State Circuits Conference Digest of Technical Papers.

Exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design

S. Wong, T. Lee, L. Madden, 2001, IEEE J. Solid State Circuits.

Monolithic CMOS distributed amplifier and oscillator

B. Kleveland, S.S. Wong, L. Madden, 1999, 1999 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC. First Edition (Cat. No.99CH36278).

New Stacked Die Interconnect Technology for High-Performance and Low-Cost FPGA

L. Madden, S. Chiu, S. Ramalingam, 2015 .

A 160 MHz 32 b 0.5 W CMOS RISC microprocessor

Richard T. Witek, Daniel W. Dobberpuhl, Andrew J. Black, 1996, 1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC.

Reliability evaluation of a CoWoS-enabled 3D IC package

Shin-Puu Jeng, Suresh Ramalingam, Liam Madden, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters

Anthony Collins, Liam Madden, Patrick Lynch, 2014, IEEE Journal of Solid-State Circuits.

Advancing high performance heterogeneous integration through die stacking

Xin Wu, Khaldoon Abugharbieh, Liam Madden, 2012, 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC).

Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology

Suresh Ramalingam, Steve Chiu, Liam Madden, 2013 .

Quality and Reliability of 3D High-Performance Heterogeneous Integration through Die Stacking

L. Madden, B. Banijamali, S. Ramalingam, 2012 .

High-frequency characterization of on-chip digital interconnects

Robert W. Dutton, Mark Horowitz, Xiaoning Qi, 2002, IEEE J. Solid State Circuits.