J. Lu

A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects

J. Lu, Y. Kwon, G. Rajagopalan, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

Detection of microwave radiation by electronic fluid in high electron mobility transistors

Mikhail I. Dyakonov, M. Shur, J. Lu, 1996 .

Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives

J. Lu, Y. Kwon, J. McDonald, 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).

Bonding interfaces in wafer-level metal/adhesive bonded 3D integration

J.-Q. Lu, J. Lu, J. McMahon, 2008, 2008 58th Electronic Components and Technology Conference.

Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect

J.-Q. Lu, J. Lu, J. McMahon, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform

J.-Q. Lu, S. Pozder, J. Lu, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

Grain Based Modeling of Stress Induced Copper Migration for 3D-IC Interwafer Vias

J. Lu, T. Cale, R. Gutmann, 2006, 2006 International Conference on Simulation of Semiconductor Processes and Devices.

Influences of grain structure on thermally induced stresses in 3D IC inter-wafer vias

J. Lu, T. Cale, R. Gutmann, 2007 .

Densification of Carbon Nanotube Bundles for Interconnect Application

J.-Q. Lu, P. Ajayan, J. Lu, 2007, 2007 IEEE International Interconnect Technology Conferencee.