B. Xu

A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects

J. Lu, Y. Kwon, G. Rajagopalan, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

Investigation of strain in microstructures by a novel moire method

James Castracane, Huimin Xie, Bai Xu, 2002 .

Fabrication of Flexible One-Dimensional Porous Silicon Photonic Band-Gap Structures

Natalya Tokranova, James Castracane, Bai Xu, 2003 .

Fabrication of cantilever probes with integrated piezoresistive read-out and built-in piezoelectric actuators

Natalya Tokranova, James Castracane, Steve Olson, 2005, SPIE MOEMS-MEMS.

Novel spatially distributed porous Si optical bandpass filters

Natalya Tokranova, James Castracane, Alison Gracias, 2006, SPIE OPTO.

Emerging Nanoscale Interconnect Processing Technologies: Fundamental and Practice

Anna W. Topol, Timothy C. Stoner, B. Xu, 2009 .

Nanoporous Si – Organic Composite Photovoltaics

B. Xu, J. Castracane, N. Tokranova, 2004 .