R. Yu

Electrical integrity of state-of-the-art 0.13 /spl mu/m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication

Anna W. Topol, D.J. Frank, G.M. Cohen, 2002, Digest. International Electron Devices Meeting,.

Wafer-scale microdevice transfer/interconnect: from a new integration method to its application in an afm-based data-storage system

H. B. Pogge, R. Yu, M. Despont, 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

Wafer-scale microdevice transfer/interconnect: its application in an AFM-based data-storage system

P. Vettiger, U. Drechsler, M. Despont, 2004, Journal of Microelectromechanical Systems.